
STANDARD APPLICATION
2
4
6
8
19
20
11
9
Margin Up
V
I
Track
+Sense
+
PTH12040W
V
I
V
I
UVLO Prog
Margin Down
18
Track
12
15
14
V
O
V
O
V
O
–Sense
7
1
Inhibit
17
GND
3
5
10
13
16
GNDGND
GND GND GND V
OAdjust
Track
Margin Up
Margin Down
C
I
560 mF
(Required)
R
SET
1%
0.05 W
L
O
A
D
+Sense
C
O1
330 mF
(Required)
C
O2
330 mF
(Required)
+
V
O
–Sense
GND
V
I
Inhibit
UDG-08112
ABSOLUTE MAXIMUM RATINGS
SLTS237G – DECEMBER 2004 – REVISED MARCH 2009............................................................................................................................................... www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
A.
RSET = Required to set the output voltage higher than the minimum value (see the elcetrical characheristics for
values.)
B.
CI = Required 560-F electrolytic capacitor. 1000 F recommended.
C.
CO = Required 660-F (or 680 F) electrolytic capacitor.
ORDERING INFORMATION
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or see
the TI website at www.ti.com.
over operating free-air temperature range (unless otherwise noted)
UNIT
Signal input voltages
Track control (pin 18)
–0.3 V to VI + 0.3 V
TA
Operating temperature range over VI range
–40°C to 85°C
PTH12040WAH
Wave solder
Surface temperature of module body or pins
Twave
260°C (1)
temperature
(5 seconds maximum)
PTH12040WAD
PTH12040WAS
235°C (1)
Solder reflow
Treflow
Surface temperature of module body or pins
temperature
PTH12040WAZ
260°C (1)
Tstg
Storage temperature
Storage temperature of module removed from shipping package
–55°C to 125°C
Tpkg
Packaging temperature
Shipping Tray storage or bake temperature
45°C
Mechanical shock
Per Mil-STD-883D, Method 2002.3, 1 msec, 1/2 Sine, mounted
500 G
Mechanical vibration
Mil-STD-883D, Method 2007.2, 20–2000 Hz
15 G
Weight
17 grams
Flammability
Meets UL94V-O
(1)
During the soldering process, do not elevate peak temperature of the module, pins, or internal components above the stated maximum.
2
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