参数资料
型号: PUMA2SV16000MB-020
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 20 ns, CHMA66
封装: CERAMIC, PGA-66
文件页数: 10/10页
文件大小: 195K
代理商: PUMA2SV16000MB-020
Military Screening Procedure
MultiChip Screening Flow for high reliability product in accordance with Mil-883 method 5004 shown below
Visual and Mechanical
Internal visual
2017 Condition B or manufacturers equivalent
100%
Temperature cycle
1010 Condition B (10 Cycles,-55°C to +125°C)
100%
Constant acceleration
2001 Condition E (Y
1 only) (10,000g)
100%
Burn-In
Pre-Burn-in electrical
Per applicable device specifications at T
A=+25
°C
100%
Burn-in
Method 1015,Condition D,T
A=+125
°C,160hrs min
100%
Final Electrical Tests
Per applicable Device Specification
Static (dc)
a) @ T
A=+25
°C and power supply extremes
100%
b) @ temperature and power supply extremes
100%
Functional
a) @ T
A=+25
°C and power supply extremes
100%
b) @ temperature and power supply extremes
100%
Switching (ac)
a) @ T
A=+25
°C and power supply extremes
100%
b) @ temperature and power supply extremes
100%
Percent Defective allowable (PDA)
Calculated at post burn-in at T
A=+25
°C
10%
Hermeticity
1014
Fine
Condition A
100%
Gross
Condition C
100%
Quality Conformance
Per applicable Device Specification
Sample
External Visual
2009 Per vendor or customer specification
100%
SCREEN
TEST METHOD
LEVEL
MB MULTICHIP MODULE SCREENING FLOW
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