参数资料
型号: PUMA68SV16000B-35
元件分类: SRAM
英文描述: 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, PQMA68
封装: PLASTIC, LCC-68
文件页数: 9/9页
文件大小: 126K
代理商: PUMA68SV16000B-35
PUMA 68SV16000 - 020/025/35
Issue 2.0 : May 2001
9
Visual Inspection Standard
All devices inspected to ANSI 2 standard
Moisture Sensitivity
Devices are moisture sensitive.
Shelf Life in Sealed Bag 12 months at <40OC and <90% relative humidity (RH).
After this bag has been opened, devices that will be subjected to infrared reflow, vapour phase reflow, or equivalent
processing (peak package body temp 220OC) must be :
A : Mounted within 72 Hours at factory conditions of <30OC/60% RH
OR
B : Stored at <20% RH
If these conditions are not met or indicator card is >20% when read at 23OC +/-5% devices require baking as
specified below.
If baking is required, devices may be baked for :-
A : 24 hours at 125OC +/-5% for high temperature device containers
OR
B : 192 hours at 40OC +5OC/-0OC and <5% RH for low temperature device containers.
Packaging Standard
Devices packaged in dry nitrogen, JED-STD-020.
Packaged in trays as standard.
Tape and reel available for shipment quantities exceeding 200pcs upon request.
Soldering Recomendations
IR/Convection -
Ramp Rate
6OC/sec max.
Temp. exceeding 183OC 150 secs. max.
Peak Temperature
225OC
Time within 5OC of peak
20 secs max.
Ramp down
6OC/sec max.
Vapour Phase -
Ramp up rate
6OC/sec max.
Peak Temperature
215 - 219OC
Time within 5OC of peak
60 secs max.
Ramp down
6OC/sec max.
Note : The above recomendations are based on standard industry practice.
Failiure to comply with the above recomendations invalidates product warranty.
Customer Guidelines
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