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参数资料
| 型号： | PZ60303-002-T |
| 厂商： | HON HAI PRECISION INDUSTRY CO LTD |
| 元件分类： | 插座 |
| 英文描述： | PGA603, IC SOCKET |
| 文件页数： | 1/1页 |
| 文件大小： | 184K |
| 代理商： | PZ60303-002-T |
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.
SPECIFICATIONS
mPGA603 Socket
BGA Se ries CPU Socket
Ve rti cal, SM T Type
1. 27mm [.050
”] Pitch
6 03 P os.
Mechanical
Contact Retention Force: 0.065Kg min.
Durability: 50 Cycles
Electrical
Contact Resistance: 25m
max.
Dielectric Withstanding Voltage: 400V RMS min.
Insulation Resistance: 360M
min.
Physical
Cover: Thermoplastic, UL 94V-0 rated, Natural Color
Base: Thermoplastic, UL 94V-0 rated, Black Color
Cam: Zinc Alloy
Contact: Copper Alloy
Plating: See “ORDERING INFORMATION”
Operating Temperature: -40
℃ to +105℃
DRAWING
ORDERING INFORMATION
PRODUCT NO.: P Z 603 * 3 - 002 - T
Contact Area Plating
3=30
" Gold
Termination Type & Length
0=63/37 Sn/Pb; 1=LeadFree Type
P=PGA Socket
No. Of Pos.
603=603 Pos.
ZIF
Hard Tray Package
002=With Alignment Post
Hard Tray Package
T=Tooless Type
DIM A
The Socket Height:
5.81
±0.20mm Before Soldering On Board
5.65
±0.20mm After Soldering On Board
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