- 您现在的位置：买卖IC网 > PDF目录296933 > QB00FMY TRANSISTOR OUTPUT SOLID STATE RELAY PDF资料下载
参数资料
| 型号： | QB00FMY |
| 元件分类： | 继电器，输入/输出模块 |
| 英文描述： | TRANSISTOR OUTPUT SOLID STATE RELAY |
| 文件页数： | 1/4页 |
| 文件大小： | 54K |
| 代理商： | QB00FMY |
Bi-Directional Solid State Relay
QB00FM
OPTICALLY ISOLATED BI-DIRECTIONAL AND DC OUTPUT
BD-5
BD
AC
DC
A
D
DC
FEATURES
High voltage output
Low ON resistance
Power FET output
Optical isolation
Fast switching speed
High surge current capability
Capable of DC or bi-directional
DC switching (AC)
Parameters tested utilizing MIL-
R-28750 test methods
APPLICATIONS
Ideal for Automatic Test
Equipment (ATE)
High voltage systems
High speed switching with low
EMI
Squib Fire
DESCRIPTION
The QB00FM relay is an advanced
solid state bi-directional relay
designed for high speed power
switching applications. This relay
utilizes state-of-the-art solid state
circuit technology and
manufacturing techniques to
provide high reliability, low life cycle
cost and exceptional switch
performance.
The QB00FM is capable of
switching AC or DC power. The
three output terminals can be
configured for DC switching with ON
resistance reduced to 25 milliohms
and a current rating of 10 A
continuous.
Other features include optical
coupling to minimize EMI
generation and to protect logic
circuits from output voltage
transients.
The QB00FM is packaged in a
hermetically sealed low profile
package suitable for heat sink or
circuit card mounting. Pin 6 is
connected to the case for additional
safety shielding.
Part
Relay Description
Number*
QB00FM
±10A @ ±150Vdc Output
Solid State Relay
* The Y suffix denotes parameters tested to MIL-R-28750 specifications.
The W suffix denotes parameters tested to Teledyne specifications.
ELECTRICAL SPECIFICATIONS
(-55°C TO +105°C AMBIENT TEMPERATURE
UNLESS OTHERWISE SPECIFIED)
INPUT (CONTROL) SPECIFICATION
(See Fig. 1 and Note 1)
Min
Max
Units
Input Current @ VIN = 6 Vdc
38.0
mAdc
Turn-Off Voltage (Guaranteed Off)
1.5
Vdc
Turn-On Voltage (Guaranteed On)
4.5
Vdc
Reverse Voltage Polarity
-16
Vdc
Input Supply Range (See Fig. 2 and Note 1)
4.5
16.0
Vdc
OUTPUT (LOAD) SPECIFICATIONS
Bi-directional Configuration (See Fig. 1)
Min
Max
Units
Continuous Load Current (See Fig. 3)
±10
Adc
Leakage Current @ VLOAD = ±150 Vdc (25°C)
±10
Adc
Leakage Current @ VLOAD = ±150 Vdc (105°C)
±100
Adc
Output Voltage Drop
1.7
Vdc
Continuous Operating Output Voltage
±150
Vdc
Transient Blocking Voltage (See Note 3)
±180
Vdc
ON Resistance Rds (on) at TJ = 25°C
0.10
Ohms
ILOAD = 100 mAdc (See Fig. 4 and Note 4)
Turn-On Time (See Fig.5)
7.5
ms
Turn-Off Time (See Fig. 5)
2.0
ms
dV/dt @ +25°C
100
V/s
Output Capacitance at 25 Vdc, 100 KHz
1600
pF
12/96
1996 TELEDYNE RELAYS
相关PDF资料 |
PDF描述 |
|---|---|
| QB00FMW | TRANSISTOR OUTPUT SOLID STATE RELAY, 500 V ISOLATION-MAX |
| QB00FMY | TRANSISTOR OUTPUT SOLID STATE RELAY, 500 V ISOLATION-MAX |
| QCK5 | 4 mm SLOT WIDTH, 1 CHANNEL SLOTTED OPTICAL SWITCH TRANSISTOR OUTPUT |
| QD2764A-1 | 8K X 8 UVPROM, 180 ns, CDIP28 |
| QDAN48 | COPPER ALLOY, WIRE TERMINAL |
相关代理商/技术参数 |
参数描述 |
|---|---|
| QB00KF | 制造商:Teledyne Relays 功能描述:RF/ATTENUATORS - Bulk |
| QB0402A15WCATD | 功能描述:Heat Sink Aluminum Nitride Ceramic Heat Spreader 制造商:american technical ceramics 系列:Q-Bridge 零件状态:有效 类型:散热片 冷却封装:- 接合方法:SMD 基座 形状:矩形 长度:0.040"（1.02mm） 宽度:0.02"（0.38mm） 直径:- 离基底高度（鳍片高度）:0.020"（0.51mm） 不同温升时功率耗散:- 不同强制气流时的热阻:- 自然条件下热阻:25°C/W 材料:氮化铝陶瓷型 材料镀层:- 标准包装:1 |
| QB0402A20WCATD | 功能描述:Heat Sink Aluminum Nitride Ceramic Heat Spreader 制造商:american technical ceramics 系列:Q-Bridge 零件状态:有效 类型:散热片 冷却封装:- 接合方法:SMD 基座 形状:矩形 长度:0.040"（1.02mm） 宽度:0.02"（0.38mm） 直径:- 离基底高度（鳍片高度）:0.020"（0.51mm） 不同温升时功率耗散:- 不同强制气流时的热阻:- 自然条件下热阻:32°C/W 材料:氮化铝陶瓷型 材料镀层:- 标准包装:1 |
| QB0402A20WYTB | 功能描述:THERMAL CONDUCTOR Q-BRIDGE 制造商:american technical ceramics 系列:Q-Bridge 零件状态:在售 类型:散热片 冷却封装:- 接合方法:SMD 基座 形状:矩形 长度:0.040"（1.02mm） 宽度:0.020"（0.51mm） 直径:- 离基底高度（鳍片高度）:0.020"（0.51mm） 不同温升时功率耗散:- 不同强制气流时的热阻:- 自然条件下热阻:25°C/W 材料:氮化铝陶瓷型 材料镀层:- 标准包装:1 |
| QB0402B15WCATD | 功能描述:Heat Sink Beryllium Oxide Ceramic Heat Spreader 制造商:american technical ceramics 系列:Q-Bridge 零件状态:有效 类型:散热片 冷却封装:- 接合方法:SMD 基座 形状:矩形 长度:0.040"（1.02mm） 宽度:0.02"（0.38mm） 直径:- 离基底高度（鳍片高度）:0.015"（0.38mm） 不同温升时功率耗散:- 不同强制气流时的热阻:- 自然条件下热阻:16°C/W 材料:氧化铍陶瓷 材料镀层:- 标准包装:1 |
发布紧急采购，3分钟左右您将得到回复。