参数资料
型号: QMK325B7104MN-T
厂商: Taiyo Yuden
文件页数: 17/20页
文件大小: 0K
描述: CAP CER 0.1UF 250V 20% X7R 1210
产品变化通告: X5R, X7R Part Number Change
标准包装: 2,000
系列: M
电容: 0.1µF
电压 - 额定: 250V
容差: ±20%
温度系数: X7R
安装类型: 表面贴装,MLCC
工作温度: -55°C ~ 125°C
应用: 通用
封装/外壳: 1210(3225 公制)
尺寸/尺寸: 0.126" L x 0.098" W(3.20mm x 2.50mm)
厚度(最大): 0.083"(2.10mm)
特点: 高电压
包装: 带卷 (TR)
其它名称: CG QMK325 B7104MN-T
QMK325BJ104MN-T
QMK325BJ104MN-T-ND
(2)Examples of good and bad solder application
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Component placement close to
the chassis
Solder (for grounding)
Electrode pattern
Lead wire of component
Solder-resist
Hand-soldering of leaded
Soldering iron
Solder-resist
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations (Capacitor layout on PCBs)
1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any
stresses from board warp or deflection.
possible mechanical
Items
Deflection of board
Not recommended
Recommended
Place the product at a right
angle to the direction of the
anticipated mechanical
stress.
1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.
E
D
Perforation
C
A
Slit
B
Magnitude of stress
A>B=C>D>E
1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods
are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,
split methods as well as chip location.
3. Mounting
◆Adjustment of mounting machine
1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.
2. Maintenance and inspection of mounting machines shall be conducted periodically.
Precautions
◆Selection of Adhesives
1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the
following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and
hardening period. Therefore, please contact us for further information.
? This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
c_mlcc_prec_e-E02R01
相关PDF资料
PDF描述
745491-2 CONN D-SUB RECPT 9P 22-26AWG AU
LMK325BJ475MD-T CAP CER 4.7UF 10V 20% X5R 1210
HMK325B7224MN-T CAP CER 0.22UF 100V 20% X7R 1210
QMK325B7473KN-T CAP CER 0.047UF 250V X7R 1210
745492-2 CONN D-SUB PLUG 9P 22-26AWG AU
相关代理商/技术参数
参数描述
QMK325B7154KNHT 功能描述:CAP CER 0.15UF 250V X7R 1210 制造商:taiyo yuden 系列:M 包装:剪切带(CT) 零件状态:在售 电容:0.15μF 容差:±10% 电压 - 额定:250V 温度系数:X7R 工作温度:-55°C ~ 125°C 特性:- 等级:AEC-Q200 应用:汽车,SMPS 滤波 故障率:- 安装类型:表面贴装,MLCC 封装/外壳:1210(3225 公制) 大小/尺寸:0.126" 长 x 0.098" 宽(3.20mm x 2.50mm) 高度 - 安装(最大值):- 厚度(最大值):0.083"(2.10mm) 引线间距:- 引线形式:- 标准包装:1
QMK325B7154KN-T 制造商:TAIYO YUDEN 功能描述:Cut Tape 制造商:Taiyo Yuden 功能描述:Ceramic capacitor 1210 X7R 250V 150nF 制造商:Taiyo Yuden 功能描述:Cap Ceramic 0.15uF 250V X7R 10% SMD 1210 125
QMK325B7224KN-L 功能描述:CAP CER 0.22UF 250V 10% X7R 1210 RoHS:是 类别:电容器 >> 陶瓷 系列:M 标准包装:4,000 系列:- 电容:1000pF 电压 - 额定:50V 容差:±10% 温度系数:X7R 安装类型:表面贴装,MLCC 工作温度:-55°C ~ 125°C 应用:自动 额定值:AEC-Q200 封装/外壳:0805(2012 公制) 尺寸/尺寸:0.079" L x 0.047" W(2.00mm x 1.20mm) 高度 - 座高(最大):- 厚度(最大):- 引线间隔:- 特点:- 包装:带卷 (TR) 引线型:-
QMK325B7224KN-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MIDHI VOL 1210 250V X7R .22uF 10% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel
QMK325B7224MN-T 功能描述:多层陶瓷电容器MLCC - SMD/SMT CAP MIDHI VOL 1210 250V X7R .22uF 20% RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel