参数资料
| 型号： | QSE-014-01-F-D-DP-A-K |
| 厂商： | Samtec Inc |
| 文件页数： | 1/1页 |
| 文件大小： | 0K |
| 描述： | CONN RCPT HI-SPEED DUAL 28POS |
| 标准包装： | 1 |
| 系列： | QStrip® QSE |
| 连接器类型： | 差分对阵列，母 |
| 位置数： | 28 |
| 间距： | 0.031"（0.80mm） |
| 行数： | 2 |
| 安装类型： | 表面贴装 |
| 特点： | 板导轨，接地母线（板），屏蔽 |
| 触点表面涂层： | 金 |
| 触点涂层厚度： | 闪光 |
| 包装： | 管件 |
| 配接层叠高度： | 5mm，8mm，11mm，16mm，19mm，25mm |
| 板上方高度： | 0.128"（3.25mm） |
| 配套产品： | QTE-014-01-L-D-DP-A-K-TRCT-ND - CONN HEADER HI-SPEED DUAL 28POS QTE-014-01-L-D-DP-A-K-TR-ND - CONN HEADER HI-SPEED DUAL 28POS QTE-014-03-L-D-DP-A-ND - CONN HEADER HI-SPEED DUAL 28POS QTE-014-03-F-D-DP-A-K-ND - CONN HEADER HI-SPEED DUAL 28POS QTE-014-01-L-D-DP-A-TR-ND - CONN HEADER HI-SPEED DUAL 28POS QTE-014-01-H-D-DP-A-K-ND - CONN HEADER HI-SPEED DUAL 28POS |
F-214
QSE–028–01–F–D–DP–A
?
(0,80 mm) .0315"
QSE–020–01–L–D–A
QSE–060–01–F–D–A
QSE SERIES
HIGH SPEED GROUND PLANE SOCKET
Beam
Design
QTE/QSE
5 mm Stack Height
ocol
Prot orted
XAUI
PCI Express
MGT (Rocke ?
Download app
w.samtec.com
tec.com
t SIG @ sam
ns on protoc
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?QSE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50μ" (1,27 μm) Ni
Current Rating:
Contacts:
2 A per pin
(1 pin powered per row)
Ground Plane:
11.6 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
225 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Processing:
Lead–Free Solderable: Yes
Blade &
Board Mates:
QTE
Cable Mates:
EQCD, EQDP, EQRF
(See Also Available note)
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling –D 9 GHz / 18 Gbps 9 GHz / 18 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps 14 GHz / 28 Gbps
Differential Pair Signaling –DP 8.5 GHz / 17 Gbps 13.5 GHz / 27 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QSE or contact sig@samtec.com
Integral metal plane
for power or ground
s
Supp
100 GbE
?
SATA
t I/O)
In finiBand
notes at
/appnote
ww
Contac ols
for questio
SMT Lead Coplanarity:
(0,10 mm) .004" max (020-060)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
QSE
PINS PER ROW
NO. OF PAIRS
01
PLATING
OPTION
TYPE
A
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO: 090871_0_000
ALSO AVAILABLE
(MOQ Required)
? 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery speci?cations.)
(7,24)
.285
02
01
–020, –040, –060
(40 total pins per bank = –D)
–014, –028, –042
(14 pairs per bank = –D–DP)
–D–DP = (No. of Positions per Row/14) x
(20,00) .7875 + (1,27) .050
–D = (No. of Positions per Row/20) x
(20,00) .7875 + (1,27) .050
(20,00) .7875
(0,80) (0,15)
.0315 .006
(7,49)
.295
–F
= Gold Flash on
Signal Pins and
Ground Plane, Matte
Tin on tails
–L
= 10μ" (0,25 μm) Gold
on Signal Pins
and Ground Plane,
Matte Tin on tails
–C*
= Electro-Polished
Selective
50μ" (1,27 μm) min
Au over 150μ"
(3,81 μm) Ni on Signal
Pins in contact area,
10μ" (0,25 μm) min
–D
= Single-
Ended
–D–DP
= Differential
Pair
(–01 only)
QTE MATED
LEAD HEIGHT
STYLE WITH QSE*
–01 (5,00) .197
–02 (8,00) .315
–03 (11,00) .433
–GP
= Guide Post
(–020 only)
–K
= (8,25 mm) .325"
DIA Polyimide
Film Pick &
Place Pad
–TR
= Tape & Reel
Packaging
–L
= Latching Option
(N/A on –042
& –060 positions)
–05
Ni on Ground Plane
–07
(1,27 μm) min Ni on
all solder tails
OTHER
SOLUTIONS
? 30μ" (0,76 μm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
? Edge Mount
? 56 (-DP), 80, 100
positions per row
? Guide Posts and Friction
Lock options.
? Retention Option
Contact Samtec.
(3,05)
.120
(0,89)
.035
DIA
(0,76)
.030
–L
(3,25)
.128
(0,64)
.025
Au over 50μ" (1,27 μm) –04 (16,00) .630
(19,00) .748
in contact area,
(25,00) .984
Matte Tin over 50μ"
*Processing conditions
will affect mated
height.
*Note: –C Plating passes
10 year MFG testing
Note: Some lengths, styles
and options are non-standard,
non-returnable. ? Board Spacing Standoffs.
See SO Series
WWW.SAMTEC.COM
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相关代理商/技术参数 |
参数描述 |
|---|---|
| QSE-014-01-F-D-DP-A-K-TR | 制造商:Samtec Inc 功能描述:CONN SCKT STRP SKT 28 POS 0.8MM SLDR ST SMD - Tape and Reel |
| QSE-014-01-F-D-DP-A-L | 制造商:Samtec Inc 功能描述:.8MM DOUBLE ROW MI SOCKET ASSEMBLY - Bulk |
| QSE-014-01-F-D-DP-A-L-K | 制造商:Samtec Inc 功能描述:.8MM DOUBLE ROW MI SOCKET ASSEMBLY - Bulk |
| QSE-014-01-F-D-DP-A-L-K-TR | 制造商:Samtec Inc 功能描述:.8MM DOUBLE ROW MI SOCKET ASSEMBLY - Tape and Reel |
| QSE-014-01-F-D-DP-A-RT1 | 制造商:Samtec Inc 功能描述:CONN DP SKT 28 POS 0.8MM SLDR ST SMD - Bulk |
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