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参数资料
| 型号： | QSE-056-01-TL-D-DP-EM3 |
| 厂商： | SAMTEC INC |
| 元件分类： | 电路板相叠连接器 |
| 英文描述： | 112 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET |
| 文件页数： | 1/2页 |
| 文件大小： | 279K |
| 代理商： | QSE-056-01-TL-D-DP-EM3 |
DO NOT
SCALE FROM
THIS PRINT
((No OF POSITIONS / 14) x .7875[20.003]) + .440[11.18] REF
.2850 7.239
REF
((No OF POSITIONS / 14) x .7875[20.003]) + .0100[.254] REF
.6250 15.875
REF
.793
REF
20.130
.0225
REF
0.571
6 EQ SPACES
@ .0945 [2.400]
'D'
C1
01
02
FIG. 1
QSE-042-01-X-D-DP-EMX SHOWN
QSE-XXX-01-X-D-DP-EMX-XX
No OF PAIRS
-014, -028, -042
** -056, **-070
(PER ROW)
ROW SPECIFICATION
-D: DOUBLE (USE QSE-20-01-D-EMX-XX)
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD WITH
MATTE TIN TAILS (SEE NOTE 6)
(USE C-162-XX-F & T-1G13-01-F)
-L: LIGHT SELECTIVE GOLD WITH
MATTE TIN TAILS
(USE C-162-XX-L & T-1G13-01-L)
-H: HEAVY GOLD WITH GOLD LEADS
(USE C-162-XX-H & T-1G13-01-G)
-TL: TIN/LEAD
LEAD STYLE
-01: .1380[3.505]
No OF BANKS
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QSE-20-01-D-EM2-XX & C-162-01-X)
DIFFERENTIAL PAIR
-GP: GUIDE POST
(SEE FIG.3, SHEET 2)
*
* EM3-GP=NOT TOOLED
OPTION
-EM3: (USE QSE-20-01-D-EM3-XX
& C-162-02-X) SEE NOTE 10
** SEE NOTE 11
.7250 18.415
REF
.175 4.45
REF
.1200 3.048
REF
.120
REF
3.05
.1370±.0030 3.480±0.08
.1180 2.997
.0060 0.152
REF
.1545 3.924
(TYP)
2 MAX SWAY
SEE TABLE 1
"A"
T-1G13-01-X
QSE-20-01-D-EMX-03
C2
C7
T
.1000
REF
2.540
.0400
REF
1.016
.0070
REF
0.178
.1600
REF
4.064
.2380 6.045
REF
.0580
REF
1.473
.0660±.0030 1.676±0.076
SECTION "A"-"A"
EDGE MOUNT THICKNESS
-EM2: .064 [1.63] +/-.004 PCB
C-162-01-X
QSE-20-01-D-EM2-XX
C5
.0890
REF
2.261
.0920±.0030 2.338±0.076
C-162-02-X
QSE-20-01-D-EM3-XX
EDGE MOUNT THICKNESS
-EM3:
(DIFFERENT AS SHOWN, OTHERWISE
SAME AS -EM2 PCB THICKNESS)
(SEE NOTE 10)
C6
SECTION "A-A"
C
ASO ONLY (APPLICATION SPECIFIC ORDER)
SEE NOTE 5
C7
T
SHEET OF
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
ANGLES
.XX: .01[.3]
2
.XXX: .005[.13]
.XXXX: .0020[.051]
MATERIAL:
.8mm EDGEMOUNT DIFF PAIR HS SOCKET ASSEMBLY
BY:
QSE-XXX-01-X-D-DP-EMX-XX
DWG. NO.
DESCRIPTION:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DO NOT SCALE DRAWING
DEAN P
4/10/2001
2
1
SHEET SCALE: 1.25:1
INSULATOR: LCP, COLOR: BLACK
CONTACT: PHOS BRONZE
GROUND PLANE: PHOS BRONZE
F:\DWG\MISC\MKTG\QSE-XXX-01-X-D-DP-EMX-XX-MKT.SLDDRW
NOTES:
1.
REPRESENTS A CRITICAL DIMENSION.
2. CONTACT RETENTION: 6 OZ MIN.
3. GROUND PLANE RETENTION: 8 OZ MIN.
4. PARTS ARE MOLD TO POSITION.
5. MAX VARIANCE OF .002[.05].
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. NOTE DELETED.
8. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
9. SEE http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EDGE MOUNT PARTS.
10. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY.
PLEASE CONTACT SAMTEC INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
11. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT SAMTEC
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
REVISION T
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