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参数资料
| 型号： | QT62-C-1-M-60.000MHZ |
| 厂商： | Q-TECH CORP |
| 元件分类： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 60 MHz, CMOS OUTPUT |
| 封装： | ROHS COMPLIANT, HERMETIC SEALED, CERAMIC, SMD, 44 PIN |
| 文件页数： | 5/6页 |
| 文件大小： | 310K |
| 代理商： | QT62-C-1-M-60.000MHZ |
55
Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com
Q-TECH
CORPORATION
LEADLESS CHIP CARRIER
CRYSTAL CLOCK OSCILLATORS
1.8 to 15Vdc - 732.4Hz to 125MHz
LeadlessChipCarrier (RevisionC,July2008)(ECO#9357)
45
Hybrid Case
Substrate
Die
D/A epoxy
Heat
Die
R1
D/A epoxy
Substrate
D/A epoxy
Hybrid Case
R2
R3
R4
R5
ThermalCharacteristics
JA
JC
CA
Die
T
C
A
J
CA
JC
(Figure1)
(Figure2)
Theheattransfermodelinahybridpackageisdescribedin
figure1.
Heatspreadingoccurswhenheatflowsintoamateriallayerof
increasedcross-sectionalarea. Itisadequatetoassumethat
spreadingoccursata45°angle.
Thetotalthermalresistanceiscalculatedbysummingthe
thermalresistancesofeachmaterialinthethermalpath
betweenthedeviceandhybridcase.
RT=R1+R2+R3+R4+R5
ThetotalthermalresistanceRT(seefigure2)betweentheheat
source(die)tothehybridcaseistheThetaJunctiontoCase
(ThetaJC)in°C/W.
Thetajunctiontocase(ThetaJC)forthisproductis30°C/W.
Thetacasetoambient(ThetaCA)forthispartis100°C/W.
ThetaJunctiontoambient(ThetaJA)is130°C/W.
MaximumpowerdissipationPDforthispackageat25°Cis:
PD(max)=(TJ(max)–TA)/ThetaJA
WithTJ=175°C(Maximumjunctiontemperatureofdie)
PD(max)=(175–25)/130=1.15W
EnvironmentalSpecifications
Q-TechStandardScreening/QCI(MIL-PRF55310)isavailableforallofourLeadlessChipCarrierpackages. Q-Techcanalso
customizescreeningandtestprocedurestomeetyourspecificrequirements. TheLeadlessChipCarrierpackagesaredesignedand
processedtoexceedthefollowingtestconditions:
EnvironmentalTest
TestConditions
Temperaturecycling
MIL-STD-883,Method1010,Cond.B
Constantacceleration
MIL-STD-883,Method2001,Cond.A,Y1
SealFineLeak
MIL-STD-883,Method1014,Cond.A
Burn-in
160hours,125°Cwithload
Aging
30days,70°C,±1.5ppmmax
Vibrationsinusoidal
MIL-STD-202,Method204,Cond.D
Shock,nonoperating
MIL-STD-202,Method213,Cond.I
Thermalshock,nonoperating
MIL-STD-202,Method107,Cond.B
Ambientpressure,nonoperating
MIL-STD-202,105,Cond.C,5minutesdwelltimeminimum
Resistancetosolderheat
MIL-STD-202,Method210,Cond.B
Moistureresistance
MIL-STD-202,Method106
Terminalstrength
MIL-STD-202,Method211,Cond.C
Resistancetosolvents
MIL-STD-202,Method215
Solderability
MIL-STD-202,Method208
PleasecontactQ-Techforhighershockrequirements
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