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参数资料
| 型号： | QT89HC-D-10-M-FREQ1 |
| 厂商： | Q-TECH CORP |
| 元件分类： | XO, clock |
| 英文描述： | CRYSTAL OSCILLATOR, CLOCK, 0.015 MHz - 16 MHz, HCMOS/TTL OUTPUT |
| 封装： | ROHS COMPLIANT, HERMETIC SEALED, MINIATURE, CERAMIC PACKAGE-4 |
| 文件页数： | 4/6页 |
| 文件大小： | 219K |
| 代理商： | QT89HC-D-10-M-FREQ1 |
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Q-TECH Corporation - 10150 W. Jefferson Boulevard, Culver City 90232 - Tel: 310-836-7900 - Fax: 310-836-2157 - www.q-tech.com
Q-TECH
CORPORATION
QT89 SERIES
HIGH-RELIABILITY MINIATURE CLOCK OSCILLATORS
1.8 to 5.0Vdc
-
15kHz to 160MHz
QT89 (RevisionC,July2008)(ECO#9382)
ReflowandSolderingTechniques
EnvironmentalSpecifications
Q-TechStandardScreening/QCI(MIL-PRF55310)isavailableforallofourQT89Products. Q-Techcanalsocustomizescreening
andtestprocedurestomeetyourspecificrequirements. TheQT89productisdesignedandprocessedtoexceedthefollowingtest
conditions:
EnvironmentalTest
TestConditions
Temperaturecycling
MIL-STD-883,Method1010,Cond.B
Constantacceleration
MIL-STD-883,Method2001,Cond.A,Y1
SealFineLeak
MIL-STD-883,Method1014,Cond.A
Burn-in
160hours,125°Cwithload
Aging
30days,70°C,±1.5ppmmax
Vibrationsinusoidal
MIL-STD-202,Method204,Cond.D
Shock,nonoperating
MIL-STD-202,Method213,Cond.I (SeeNote1)
Thermalshock,nonoperating
MIL-STD-202,Method107,Cond.B
Ambientpressure,nonoperating
MIL-STD-202,105,Cond.C,5minutesdwelltimeminimum
Resistancetosolderheat
MIL-STD-202,Method210,Cond.C
Moistureresistance
MIL-STD-202,Method106
Terminalstrength
MIL-STD-202,Method211,Cond.C
Resistancetosolvents
MIL-STD-202,Method215
Solderability
MIL-STD-202,Method208
Unlessotherwisespecified,solderingshouldbeperformedonterminalsat260Cfor10smaximum. Donotapplysolderingheaton
oscillatorpackagesinceitcoulddamagetheunit. Handsolderingisrecommended. Wavesolderat245Cfor15smax.
Theheattransfermodelinahybridpackageisdescribedin
figure1.
Heatspreadingoccurswhenheatflowsintoamateriallayerof
increasedcross-sectionalarea. Itisadequatetoassumethat
spreadingoccursata45°angle.
Thetotalthermalresistanceiscalculatedbysummingthe
thermalresistancesofeachmaterialinthethermalpathbe-
tweenthedeviceandhybridcase.
RT=R1+R2+R3+R4+R5
ThetotalthermalresistanceRT(seefigure2)betweentheheat
source(die)tothehybridcaseistheThetaJunctiontoCase
(ThetaJC)in°C/W.
Thetajunctiontocase(ThetaJC)forthisproductis30°C/W.
Thetacasetoambient(ThetaCA)forthispartis100°C/W.
ThetaJunctiontoambient(ThetaJA)is130°C/W.
MaximumpowerdissipationPDforthispackageat25°Cis:
PD(max)=(TJ(max)–TA)/ThetaJA
WithTJ=175°C(Maximumjunctiontemperatureofdie)
PD(max)=(175–25)/130=1.15W
45
Hybrid Case
Substrate
Die
D/A epoxy
Heat
Die
R1
D/A epoxy
Substrate
D/A epoxy
Hybrid Case
R2
R3
R4
R5
JA
JC
CA
Die
T
C
A
J
CA
JC
(Figure1)
(Figure2)
ThermalCharacteristics
Note1: AdditionalshockresultssuccessfullypassedonstandardQT88family16MHz,20MHz,24MHz,40MHz,and80MHz
Shock850gpeak,half-sine,1msduration(MIL-STD-202,Method213,Cond.Dmodified)
Shock1,500gpeak,half-sine,0.5msduration(MIL-STD-883,Method2002,Cond.B)
Shock36,000gpeak,half-sine,0.12msduration
PleasecontactQ-Techforhighershockrequirements
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