参数资料
型号: QTH-060-04-L-D-A
厂商: Samtec Inc
文件页数: 1/1页
文件大小: 0K
描述: CONN HEADER HS .5MM 120POS DL AU
产品培训模块: Rugged/Power Connectors
产品目录绘图: QTH Series Header
特色产品: Q Strip? High Speed Mezzanine
标准包装: 1
系列: QStrip® QTH
连接器类型: 接头,外罩触点
位置数: 120
间距: 0.020"(0.50mm)
行数: 2
安装类型: 表面贴装
特点: 板导轨,接地母线(板)
触点表面涂层:
触点涂层厚度: 10µin(0.25µm)
包装: 托盘
板上方高度: 0.600"(15.25mm)
产品目录页面: 116 (CN2011-ZH PDF)
配套产品: QSH-060-01-L-D-DP-A-ND - CONN RECPT 120POS 0.5MM SMT
QSH-060-01-L-D-A-RT1-ND - CONN RECPT 120POS 0.5MM SMT
QSH-060-01-L-D-A-K-TR-ND - CONN RECPT 120POS 0.5MM SMT
QSH-060-01-H-D-LC-ND - CONN RECPT 120POS 0.5MM SMT
QSH-060-01-H-D-A-K-ND - CONN RECPT 120POS 0.5MM SMT
QSH-060-01-F-D-A-RT1-ND - CONN RECPT 120POS 0.5MM SMT
QSH-060-01-F-D-A-K-ND - CONN RECPT 120POS 0.5MM SMT
QSH-060-01-F-D-A-ND - CONN RECPT 120POS .020" SMT GOLD
SAM8181-ND - CONN RCPT HI-SPD .5MM 120POS DL
其它名称: SAM8192
F-214
QTH–090–01–C–D–A
?
(0,50 mm) .0197"
QTH–060–07–F–D–A
QTH–030–01–L–D–A
QTH SERIES
HIGH SPEED GROUND PLANE HEADER
Integral metal plane for
QTH/QSH
5 mm Stack Height
ocol
Prot orted
100 GbE
yper transp
XAUI
PCI Expres
ATA ?
Download app
mtec.com/app
@ samtec.com
on protocols
SPECIFICATIONS
For complete speci?cations and
recommended PCB layouts see
www.samtec.com?QTH
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating: Au or Sn over
50μ" (1,27 μm) Ni
Current Rating:
Contact:
2 A per pin
(1 pin powered per row)
Ground Plane:
25 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55°C to +125°C
Voltage Rating:
125 VAC (5 mm Stack Height)
Max Cycles: 100
RoHS Compliant: Yes
Processing:
Lead–Free Solderable: Yes
SMT Lead Coplanarity:
power or ground
Board Mates:
QSH
Cable Mates:
HQCD, HQDP
(See Also Available note)
Rated @ 3dB Insertion Loss
Type
with PCB effects* w/o PCB effects**
Single-Ended Signaling –D 9 GHz / 18 Gbps 9.5 GHz / 19 Gbps
Differential Pair Signaling –D 8 GHz / 16 Gbps 10.5 GHz / 21 Gbps
Differential Pair Signaling –DP 9.5 GHz / 19 Gbps 16.5 GHz / 33 Gbps
*Performance data includes effects of a non-optimized PCB.
**Test board losses de-embedded from performance data.
Performance data for other stack heights and complete test data
available at www.samtec.com?QTH or contact sig@samtec.com
Standard Stack Heights
from 5 mm to 25 mm
s
Supp
ort ?
H
s ?
S
InfiniBand
notes at
note
www.sa
Contact SIG
for questions
(0,10 mm) .004" max (030-060)
(0,15 mm) .006" max (090)
Board Stacking:
For applications requiring
QTH
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
PLATING
OPTION
TYPE
A
OTHER
OPTION
more than two connectors per
board contact ipg@samtec.com
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FILE NO: 090871_0_000
–030, –060, –090
(60 total pins per bank = –D)
–020, –040, –060
(20 pairs per bank = –D–DP)
Specify
LEAD
STYLE
from
chart
–F
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
–L
–D
= Single-Ended
–D–DP
= Differential Pair
(–01 only)
–K
= (7,00 mm)
.275" DIA
Polyimide
?lm Pick &
Place Pad
(N/A with -05 &
-07 lead style)
(0,50)
(0,20)
.025
.035
–TR
and Ground Plane,
STYLE
QSH*
–01
–C*
–L
–02
Selective
Option
–03
over 150μ" (3,81 μm)
Ni on Signal Pins in
–04
contact area,
10μ" (0,25 μm) min Au
–05
& –090)
–07
Ni on Ground Plane
Matte Tin over 50μ"
OTHER
? Board Spacing Standoffs.
ALSO AVAILABLE
(MOQ Required)
? 14 mm, 15 mm, 22 mm
and 30 mm stack height
(Caution: Some automatic
placement/inspection
machines may have
component height
restrictions. Please consult
machinery speci?cations.)
? 30μ" (0,76 μm) Gold
(Specify -H plating
for Data Rate cable mating
applications.)
? Edge Mount & Guide Posts
? 80 (-DP), 120, 150
positions per row
? Retention Option
Contact Samtec.
(7,11)
.280
A
–D = (No. of Pins per Row/30) x (20,00) .7875
–DP = (No. of Pairs per Row/20) x (20,00) .7875
(20,00) .7875
01
02
.0197 .008
–01 & –02
–03 thru –07
(0,76)
.030
(0,64)
(0,89)
–L
DIA
A
= 10μ" (0,25 μm)
Gold on Signal Pins
QTH HEIGHT = Tape & Reel
LEAD A WITH (–090 positions
Matte Tin on tails
maximum)
(4,27) (5,00)
.168 .197
= Electro-Polished (7,26) (8,00)
.286 .315 = Latching
50μ" (1,27 μm) min Au (10,27) (11,00)
.404 .433 (–01 lead
(15,25) (16,00) style only)
.600 .630 (N/A on
(18,26) (19,00) –060 (–D–DP)
.718 .748
over 50μ" (1,27 μm)
(24,24) (25,00)
.954 .984
in contact area,
*Processing conditions
will affect mated height.
(1,27 μm) min Ni
on all solder tails
*Note: –C Plating passes
10 year MFG testing SOLUTIONS
Note: Some lengths, styles
and options are non-standard,
non-returnable. See SO Series.
WWW.SAMTEC.COM
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