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参数资料
| 型号： | R5F213J2CNNP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | MICROCONTROLLER, QCC36 |
| 封装： | 6 X 6 MM, 0.50 MM PITCH, QFN-36 |
| 文件页数： | 7/23页 |
| 文件大小： | 613K |
| 代理商： | R5F213J2CNNP |
15
ORDERING INFORMATION
PWR-8233X-XX0X
Supplemental Process Requirements:
S = Pre-Cap Source Inspection
L = Pull Test
Q = Pull Test and Pre-Cap Inspection
Blank = None of the Above
Process Requirements:
0 = Standard DDC Processing, no Burn-In (See table below.)
1 = MIL-PRF-38534 Compliant
2 = B*
3 = MIL-PRF-38534 Compliant with PIND Testing
4 = MIL-PRF-38534 Compliant with Solder Dip
5 = MIL-PRF-38534 Compliant with PIND Testing and Solder Dip
6 = B* with PIND Testing
7 = B* with Solder Dip
8 = B* with PIND Testing and Solder Dip
9 = Standard DDC Processing with Solder Dip, no Burn-In (See table below.)
Temperature Grade/Data Requirements:
1 = -55°C to +125°C
2 = -40°C to +85°C
3 = 0°C to +70°C
4 = -55°C to +125°C with Variables Test Data
5 = -40°C to +85°C with Variables Test Data
8 = 0°C to +70°C with Variables Test Data
Rating:
1 = 200 V using MOSFETs
3 = 500 V using IGBTs
*Standard DDC Processing with burn-in and full temperature test — see table below.
STANDARD DDC PROCESSING
MIL-STD-883
TEST
METHOD(S)
CONDITION(S)
INSPECTION
2009, 2010, 2017, and 2032
—
SEAL
1014
A and C
TEMPERATURE CYCLE
1010
C
CONSTANT ACCELERATION
2001
A
BURN-IN
1015, Table 1
—
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相关代理商/技术参数 |
参数描述 |
|---|---|
| R5F213J2CNNP#U0 | 制造商:Renesas Electronics Corporation 功能描述:R8C/3JC 8+4/1 HWQFN 6X6 -20 TO +85 - Trays 制造商:Renesas Electronics Corporation 功能描述:IC MCU 16BIT 8KB FLASH 36QFN |
| R5F213J2MNNP | 制造商:RENESAS 制造商全称:Renesas Technology Corp 功能描述:RENESAS MCU |
| R5F213J2MNNP#U0 | 制造商:Renesas Electronics Corporation 功能描述:R8C/3JM8+4/1 36HWQFN 6X6 -20 TO +85 - Trays 制造商:Renesas Electronics Corporation 功能描述:IC MCU 16BIT 8KB FLASH 36QFN |
| R5F213J4ANNP | 制造商:RENESAS 制造商全称:Renesas Technology Corp 功能描述:RENESAS MCU |
| R5F213J4CDNP#U0 | 制造商:Renesas Electronics Corporation 功能描述: |
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