参数资料
型号: R5F5630EDDFP#V0
厂商: Renesas Electronics America
文件页数: 33/165页
文件大小: 0K
描述: MCU RX630 2MB FLASH 100-LQFP
产品培训模块: RX Compare Match Timer
RX DMAC
标准包装: 1
系列: RX600
核心处理器: RX
芯体尺寸: 32-位
速度: 100MHz
连通性: CAN,EBI/EMI,I²C,LIN,SCI,SPI,USB
外围设备: DMA,LVD,POR,PWM,WDT
输入/输出数: 78
程序存储器容量: 2MB(2M x 8)
程序存储器类型: 闪存
RAM 容量: 128K x 8
电压 - 电源 (Vcc/Vdd): 2.7 V ~ 3.6 V
数据转换器: A/D 8x10b,14x12b,D/A 1x10b
振荡器型: 内部
工作温度: -40°C ~ 85°C
封装/外壳: 100-LQFP
包装: 托盘
R01DS0060EJ0100 Rev.1.00
Page 128 of 168
Sep 13, 2011
RX630 Group
5. Electrical Characteristics
5.4.2
Timing of Recovery from Low Power Consumption Modes
Note: The wait time varies depending on the state in which each oscillator was when the WAIT instruction was executed. The recovery
time when multiple oscillators are operating is the same period as that when the oscillator which requires the longest time of all
operating oscillators to recover is operating alone.
Figure 5.13
Software Standby Mode Cancellation Timing
Table 5.12
Timing of Recovery from Low Power Consumption Modes
Conditions: VCC = AVCC0 = VCC_USB = VBATT = 2.7 to 3.6 V, VREFH/VREFH0 = 2.7 V to AVCC0,
VSS = AVSS0 = VREFL/VREFL0 = VSS_USB = 0 V, Ta = Topr
Item
Symbol
Min.
Typ.
Max.
Unit
Test
Conditions
Recovery time
after
cancellation of
software
standby mode
Crystal resonator
connected to
main clock
oscillator
Main clock oscillator
operating
tSBYMC
10
ms
Main clock oscillator and
PLL circuit operating
tSBYPC
10
ms
External clock
input to main
clock oscillator
Main clock oscillator
operating
tSBYEX
1—
ms
Main clock oscillator and
PLL circuit operating
tSBYPE
1—
ms
Sub-clock oscillator operating
tSBYSC
2—
s
High-speed on-chip oscillator operating
tSBYHO
——2
ms
Low-speed on-chip oscillator or IWDT-specific
low-speed clock oscillator operating
tSBYLO
800
s
Recovery time after cancellation of deep software standby mode
tDSBY
1.0
ms
Wait time after cancellation of deep software standby mode
tDSBYWT
45
46
tcyc
Oscillator
ICLK
IRQ
Software standby mode
tSBYMC, tSBYPC, tSBYEX, tSBYPE,
tSBYSC, tSBYHO, tSBYLO
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