参数资料
型号: REF02CS
厂商: Analog Devices Inc
文件页数: 7/16页
文件大小: 0K
描述: IC VREF SERIES PREC 5V 8-SOIC
产品变化通告: Input Voltage Max Change 23/Mar/2009
Product Discontinuance 27/Oct/2011
标准包装: 98
基准类型: 串联,精度
输出电压: 5V
容差: ±0.45%
温度系数: 65ppm/°C
输入电压: 7 V ~ 40 V
通道数: 1
电流 - 静态: 1.6mA
电流 - 输出: 10mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 管件

REF02
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Input Voltage
Output Short-Circuit Duration
to Ground or V IN
Storage Temperature Range
J, RC, and Z Packages
P Package
Rating 1
40 V
Indefinite
–65°C to +150°C
–65°C to +125°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Operating Temperature Range
REF02A, REF02J, REF02RC
REF02CJ, REF02CZ
REF02CP, REF02CS, REF02E, and REF02H
Lead Temperature Range (Soldering 10 sec)
–55°C to +125°C
0°C to 70°C
–40°C to +85°C
300°C
THERMAL RESISTANCE
Table 6.
Package Type
TO-99 (J)
8-Lead CERDIP (Z)
θ JA1
170
162
θ JC
24
26
Unit
°C/W
°C/W
1
Absolute maximum ratings apply to both DICE packaged parts, unless
otherwise noted.
8-Lead PDIP (P)
20-Terminal Ceramic LCC (RC)
8-Lead SOIC (S)
110
120
160
50
40
44
°C/W
°C/W
°C/W
1
θ JA is specified for worst-case mounting conditions; device in socket for TO,
CERDIP, PDIP, and LCC packages; and device soldered to printed circuit
board for SOIC package.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. I | Page 7 of 16
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