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| 型号： | REF192GSZ-REEL |
| 厂商： | Analog Devices Inc |
| 文件页数： | 3/28页 |
| 文件大小： | 0K |
| 描述： | IC VREF SERIES PREC 2.5V 8-SOIC |
| 设计资源： | Software Configurable 16-Bit Quad-Channel Unipolar/Bipolar Voltage Output Using AD5754 (CN0086) Software Configurable 14-Bit Quad-Channel Unipolar/Bipolar Voltage Output Using AD5734 (CN0087) Software Configurable 12-Bit Quad Channel Unipolar/Bipolar Voltage Output Using AD5724 (CN0088) Software Configurable 16-Bit Dual-Channel Unipolar/Bipolar Voltage Output Using AD5752 (CN0092) Software Configurable 14-Bit Dual-Channel Unipolar/Bipolar Voltage Output Using AD5732 (CN0093) Software Configurable 12-Bit Dual-Channel Unipolar/Bipolar Voltage Output Using AD5722 (CN0094) |
| 标准包装： | 2,500 |
| 系列： | REF19 |
| 基准类型： | 串联，精度 |
| 输出电压： | 2.5V |
| 容差： | ±10mV |
| 温度系数： | 25ppm/°C |
| 输入电压： | 2.6 V ~ 15 V |
| 通道数： | 1 |
| 电流 - 静态： | 15µA |
| 电流 - 输出： | 30mA |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SO |
| 包装： | 带卷 (TR) |
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Data Sheet
REVISION HISTORY
9/11—Rev. K to Rev. L
Change to Condition Column for Dropout Voltage Parameter,
Table 2 ................................................................................................. 4
Change to Condition Column for Dropout Voltage Parameter,
Table 3 ................................................................................................. 5
Change to Operating Temperature Range, Table 23...................16
7/10—Rev. J to Rev. K
Add Note 1, Features Section........................................................... 1
Changes to Note 1, Table 2 ............................................................... 4
Changes to Note 1, Table 5 ............................................................... 6
Changes to Note 1, Table 8 ............................................................... 8
Changes to Note 1, Table 11 ............................................................. 9
Changes to Note 1, Table 14 ...........................................................11
Changes to Note 1, Table 17 ...........................................................12
Changes to Note 1, Table 20 ...........................................................14
Moved Figure 22 ..............................................................................20
Added Figure 23, Solder Heat Effect Section, and Figure 24;
Renumbered Sequentially ..............................................................21
Moved Negative Precision Reference Without Precision
Resistors Section ..............................................................................22
Moved Precision Current Source Section ....................................23
Moved Kelvin Connections Section .............................................24
Moved Figure 32 ..............................................................................25
Updated Outline Dimensions ........................................................26
Changes to Ordering Guide ...........................................................27
3/08—Rev. I to Rev. J
Changes to General Description ..................................................... 1
Changes to Specifications Section................................................... 4
Deleted Wafer Test Limits Section ................................................14
Changes to Table 23, Thermal Resistance Section, and
Table 24 .............................................................................................16
Changes to Figure 6.........................................................................17
Changes to Device Power Dissipation
Considerations Section ...................................................................20
Changes to Current-Boosted References with Current
REF19x Series
Changes to Precision Current Source Section ............................ 22
Changes to Figure 28 ...................................................................... 23
Changes to Figure 30 ...................................................................... 24
Changes to Low Power, Strain Gage Circuit Section.................. 25
Changes to Ordering Guide ........................................................... 27
9/06—Rev. H to Rev. I
Updated Format ................................................................. Universal
Changes to Table 25 ........................................................................ 16
Changes to Figure 6 ........................................................................ 16
Changes to Figure 10, Figure 12, Figure 14, and Figure 26 ....... 17
Changes to Figure 18 ...................................................................... 18
Changes to Figure 20 ...................................................................... 19
Changes to Figure 23 ...................................................................... 20
Changes to Figure 25 ...................................................................... 21
Updated Outline Dimensions........................................................ 25
Changes to Ordering Guide ........................................................... 26
6/05—Rev. G to Rev. H
Updated Format ................................................................. Universal
Changes to Caption in Figure 7..................................................... 16
Updated Outline Dimensions........................................................ 25
Changes to Ordering Guide ........................................................... 26
7/04—Rev. F to Rev. G
Changes to Ordering Guide ............................................................. 4
3/04—Rev. E to Rev. F
Updated Absolute Maximum Rating.............................................. 4
Changes to Ordering Guide ........................................................... 14
Updated Outline Dimensions........................................................ 24
1/03—Rev. D to Rev. E
Changes to Figure 3 and Figure 4 ................................................. 15
Changes to Output Short Circuit Behavior ................................. 17
Changes to Figure 20 ...................................................................... 17
Changes to Figure 26 ...................................................................... 19
Updated Outline Dimensions........................................................ 23
1/96—Revision 0: Initial Version
Limiting Section ..............................................................................21
Rev. L | Page 3 of 28
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| REF192GSZ-REEL7 | 功能描述:IC VREF SERIES PREC 2.5V 8-SOIC RoHS:是 类别:集成电路 (IC) >> PMIC - 电压基准 系列:REF19 产品培训模块:Voltage Reference Basics 标准包装:100 系列:- 基准类型:旁路，精度 输出电压:4.096V 容差:±0.075% 温度系数:50ppm/°C 输入电压:- 通道数:1 电流 - 阴极:1µA 电流 - 静态:- 电流 - 输出:10mA 工作温度:0°C ~ 70°C 安装类型:表面贴装 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-SOIC 包装:管件 |
| REF193 | 制造商:AD 制造商全称:Analog Devices 功能描述:Precision Micropower, Low Dropout, Voltage References |
| REF1930AIDDCT | 功能描述:Series Voltage Reference IC ±0.1% 20mA SOT-23-5 Thin, TSOT-23-5 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 参考类型:系列 输出类型:固定 电压 - 输出（最小值/固定）:3V 电压 - 输出（最大值）:- 电流 - 输出:20mA 容差:±0.1% 温度系数:25ppm/°C 噪声 - 0.1Hz 至 10Hz:12ppmp-p 噪声 - 10Hz 至 10Hz:- 电压 - 输入:3.02 V ~ 5.5 V 电流 - 电源:460μA 电流 - 阴极:- 工作温度:-55°C ~ 150°C（TJ） 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商器件封装:SOT-5 标准包装:1 |
| REF1933AIDDCT | 功能描述:Series Voltage Reference IC ±0.1% 20mA SOT-23-5 Thin, TSOT-23-5 制造商:texas instruments 系列:- 包装:剪切带（CT） 零件状态:有效 参考类型:系列 输出类型:固定 电压 - 输出（最小值/固定）:3.3V 电压 - 输出（最大值）:- 电流 - 输出:20mA 容差:±0.1% 温度系数:25ppm/°C 噪声 - 0.1Hz 至 10Hz:12ppmp-p 噪声 - 10Hz 至 10Hz:- 电压 - 输入:3.32 V ~ 5.5 V 电流 - 电源:460μA 电流 - 阴极:- 工作温度:-55°C ~ 150°C（TJ） 安装类型:表面贴装 封装/外壳:SOT-23-5 细型，TSOT-23-5 供应商器件封装:SOT-5 标准包装:1 |
| REF193ES | 制造商:AD 制造商全称:Analog Devices 功能描述:Precision Micropower, Low Dropout, Voltage References |
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