参数资料
型号: REF193GSZ-REEL
厂商: Analog Devices Inc
文件页数: 21/28页
文件大小: 0K
描述: IC VREF SERIES PREC 3V 8-SOIC
标准包装: 2,500
系列: REF19
基准类型: 串联,精度
输出电压: 3V
容差: ±10mV
温度系数: 25ppm/°C
输入电压: 3.2 V ~ 15 V
通道数: 1
电流 - 静态: 15µA
电流 - 输出: 30mA
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 带卷 (TR)
Data Sheet
SUPPLIER
T P ≥ T C
T C
USER
T P ≤ T C
REF19x Series
SUPPLIER t P
T C = –5°C
USER t P
T P
MAXIMUM RAMP UP RATE = 3°C/s
t P
T C = –5°C
MAXIMUM RAMP DOWN RATE = 6°C/s
T L
T SMAX
PREHEAT AREA
t L
T SMIN
t S
25
TIME 25°C TO PEAK
TIME
Figure 23. Classification Profile (Not to Scale)
SOLDER HEAT EFFECT
The mechanical stress and heat effect of soldering a part to a
PCB can cause output voltage of a reference to shift in value.
The output voltage of REF195 shifts after the part undergoes the
extreme heat of a lead-free soldering profile, like the one shown
in Figure 23. The materials that make up a semiconductor device
and its package have different rates of expansion and contraction.
CURRENT-BOOSTED REFERENCES WITH CURRENT
LIMITING
Whereas the 30 mA rated output current of the REF19x series is
higher than is typical of other reference ICs, it can be boosted to
higher levels, if desired, with the addition of a simple external
PNP transistor, as shown in Figure 25. Full-time current limiting is
used to protect the pass transistor against shorts.
The stress on the dice has changed position, causing shift on the
output voltage, after exposed to extreme soldering temperatures.
This shift is similar but more severe than thermal hysteresis.
Typical result of soldering temperature effect on REF19x output
value shift is shown in Figure 24. It shows the output shift due
+V S = 6V
TO 9V
(SEE TEXT)
C2
100μF
Q2
2N3906
+
R4
2 ?
Q1
TIP32A
(SEE TEXT)
R1
1k ?
R2
1.5k ?
OUTPUT TABLE
U1 V OUT (V)
REF192 2.5
REF193 3.0
REF196 3.3
REF194 4.5
REF195 5.0
F
to soldering and does not include mechanical stress.
6
5
V C
25V
D1
3
1N4148
(SEE TEXT
ON SLEEP)
2
U1
REF196 6
(SEE TABLE)
4
R3
1.82k ?
C3
0.1μF
S
C1
10μF/25V
(TANTALUM)
+
+V OUT
3.3V
@ 150mA
R1
4
S
3
V S
COMMON
F
V OUT
COMMON
Figure 25. Boosted 3.3 V Referenced with Current Limiting
2
1
0
SHIFT DUE TO SOLDER HEAT EFFECT (%)
Figure 24. Output Shift due to Solder Heat Effect
In this circuit, the power supply current of reference U1 flowing
through R1 to R2 develops a base drive for Q1, whose collector
provides the bulk of the output current. With a typical gain of 100
in Q1 for 100 mA to 200 mA loads, U1 is never required to furnish
more than a few mA, so this factor minimizes temperature-related
drift. Short-circuit protection is provided by Q2, which clamps
the drive to Q1 at about 300 mA of load current, with values as
shown in Figure 25. With this separation of control and power
functions, dc stability is optimum, allowing most advantageous
use of premium grade REF19x devices for U1. Of course, load
Rev. L | Page 21 of 28
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