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参数资料
| 型号： | REG103GA-2.5 |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 固定正电压单路输出LDO稳压器 |
| 英文描述： | 2.5 V FIXED POSITIVE LDO REGULATOR, 0.2 V DROPOUT, PDSO6 |
| 封装： | GREEN, PLASTIC, SOT-223, 6 PIN |
| 文件页数： | 4/26页 |
| 文件大小： | 830K |
| 代理商： | REG103GA-2.5 |
REG103
12
SBVS010D
Power dissipation depends on input voltage and load condi-
tions. Power dissipation is equal to the product of the
average output current times the voltage across the output
element, VIN to VOUT voltage drop.
PV
V
I
D
IN
OUT
OUT AVG
=
(–
)
()
Power dissipation can be minimized by using the lowest
possible input voltage necessary to assure the required
output voltage.
REGULATOR MOUNTING
The tab of both packages is electrically connected to ground.
For best thermal performance, the tab of the DDPAK sur-
face-mount version should be soldered directly to a circuit-
board copper area. Increasing the copper area improves heat
dissipation. Figure 12 shows typical thermal resistance from
junction to ambient as a function of the copper area for the
DDPAK.
Although the tabs of the DDPAK and the SOT-223 are
electrically grounded, they are not intended to carry any
current. The copper pad that acts as a heat sink should be
isolated from the rest of the circuit to prevent current flow
through the device from the tab to the ground pin. Solder pad
footprint recommendations for the various REG103 devices
are presented in the Application Bulletin “Solder Pad Rec-
ommendations for Surface-Mount Devices” (SBFA015),
available from the Texas Instruments web site (www.ti.com).
FIGURE 12. Thermal Resistance versus PCB Area for the Five-Lead DDPAK.
FIGURE 13. Thermal Resistance versus PCB Area for the Five-Lead SOT-223.
50
40
30
20
10
0
012345
Copper Area (Inches2)
REG103
Surface-Mount Package
1 oz. copper
Circuit-Board Copper Area
REG103
DDPAK Surface-Mount Package
THERMAL RESISTANCE vs PCB COPPER AREA
Thermal
Resistance,
JA
(
°C/W)
θ
THERMAL RESISTANCE vs PCB COPPER AREA
180
160
140
120
100
80
60
40
20
0
Thermal
Resistance,
JA
(
°C/W)
θ
012345
Copper Area (Inches2)
Circuit-Board Copper Area
REG103
SOT-223 Surface-Mount Package
REG103
Surface-Mount Package
1 oz. copper
相关PDF资料 |
PDF描述 |
|---|---|
| REG103GA-2.7 | 2.7 V FIXED POSITIVE LDO REGULATOR, 0.2 V DROPOUT, PDSO6 |
| REG103GA-3.3/2K5 | 3.3 V FIXED POSITIVE LDO REGULATOR, 0.2 V DROPOUT, PDSO6 |
| REG103FA-2.5/500 | 2.5 V FIXED POSITIVE LDO REGULATOR, 0.2 V DROPOUT, PSSO5 |
| REG103FA-2.5 | 2.5 V FIXED POSITIVE LDO REGULATOR, 0.2 V DROPOUT, PSSO5 |
| REG103FA-2.7 | 2.7 V FIXED POSITIVE LDO REGULATOR, 0.2 V DROPOUT, PSSO5 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| REG103GA-2K5 | 制造商:BB 制造商全称:BB 功能描述:DMOS 500mA Low-Dropout Regulator |
| REG103GA-2K5G4 | 制造商:BB 制造商全称:BB 功能描述:DMOS 500mA Low-Dropout Regulator |
| REG103GA-3 | 功能描述:低压差稳压器 - LDO DMOS 500mA LDO Reg RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| REG103GA-3.3 | 功能描述:低压差稳压器 - LDO DMOS 500mA LDO Reg RoHS:否 制造商:Texas Instruments 最大输入电压:36 V 输出电压:1.4 V to 20.5 V 回动电压（最大值）:307 mV 输出电流:1 A 负载调节:0.3 % 输出端数量: 输出类型:Fixed 最大工作温度:+ 125 C 安装风格:SMD/SMT 封装 / 箱体:VQFN-20 |
| REG103GA-3.3 | 制造商:Texas Instruments 功能描述:IC's |
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