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参数资料
| 型号： | REG1117FAKTTT |
| 厂商： | TEXAS INSTRUMENTS INC |
| 元件分类： | 可调正电压单路输出LDO稳压器 |
| 英文描述： | 1.225 V-1.28 V ADJUSTABLE POSITIVE LDO REGULATOR, 1.55 V DROPOUT, PSSO3 |
| 封装： | GREEN, PLASTIC, TO-263, D2PAK-3 |
| 文件页数： | 2/22页 |
| 文件大小： | 655K |
| 代理商： | REG1117FAKTTT |
REG1117
REG1117A
SBVS001D OCTOBER 1992 REVISED JULY 2004
www.ti.com
10
The SOT-223 package derives heat sinking from
conduction through its copper leads, especially the large
mounting tab. These must be soldered to a circuit board
with a substantial amount of copper remaining, as shown
in Figure 5. Circuit board traces connecting the tab and the
leads should be made as large as practical. The mounting
tab of both packages is electrically connected to VOUT.
Total Area: 50 x 50mm
35 x 17 mm
16 x 10 mm
Without backside copper:
JA ≈ 59_ C/W
q
With solid backside copper:
JA ≈ 49_ C/W
q
Figure 5. SOT-223 Circuit Board Layout Example
Other nearby circuit traces, including those on the back
side of the circuit board, help conduct heat away from the
device, even though they may not be electrically
connected. Make all nearby copper traces as wide as
possible and leave only narrow gaps between traces.
Table 1 shows approximate values of
qJA for various circuit
board and copper areas for the SOT-223 package. Nearby
heat dissipating components, circuit board mounting
conditions, and ventilation can dramatically affect the
actual
qJA. Proper heat sinking significantly increases the
maximum
power
dissipation
at
a
given
ambient
temperature, as shown in Figure 6.
Table 1. SOT-223
qJA for Various Board
Configurations
(1)
SOT-223
THERMAL
TOTAL PC
BOARD
TOPSIDE(1)
COPPER
BACKSIDE
COPPER
THERMAL
RESISTANCE
JUNCTION-
BOARD
AREA
COPPER
AREA
COPPER
AREA
JUNCTION-
TO-AMBIENT
2500mm2
46
°C/W
2500mm2
1250mm2
2500mm2
47
°C/W
2500mm2
950mm2
2500mm2
49
°C/W
2500mm2
0
51
°C/W
2500mm2
1800mm2
0
53
°C/W
1600mm2
600mm2
1600mm2
55
°C/W
2500mm2
1250mm2
0
58
°C/W
2500mm2
915mm2
0
59
°C/W
1600mm2
600mm2
0
67
°C/W
900mm2
340mm2
900mm2
72
°C/W
900mm2
340mm2
0
85
°C/W
(1) Tab is attached to the topside copper.
SOLDERING METHODS
Both REG1117 packages are suitable for infrared reflow
and vapor-phase reflow soldering techniques. The high
rate of temperature change that occurs with wave
soldering or hand soldering can damage the REG1117.
INSPEC Abstract Number: B91007604, C91012627.
Kelly, E.G. “Thermal Characteristics of Surface 5WK9
Packages.” The Proceedings of SMTCON. Surface Mount
Technology Conference and Exposition: Competitive
Surface Mount Technology, April 36, 1990, Atlantic City,
NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago,
IL, USA.
6
5
4
3
2
1
0
P
o
w
e
r
D
is
s
ip
a
ti
on
(W
att
s
)
0
255075
100
125
Ambient Temperature (
_C)
MAXIMUM POWER DISSIPATION
vs AMBIENT TEMPERATURE
P
D =(TJ (max) TA)/ JA
T
J (max) = 150_ C
q
DDPAK
SOT223
JA =85_ C/W
(340mm2 topside copper,
no backside copper)
q
JA =46_ C/W
(2500mm2 topside and
backside copper)
q
JA =27_ C/W
(4in2 one oz copper
mounting pad)
q
JA =65_ C/W
(no heat sink)
q
Figure 6. Maximum Power Dissipation versus Ambient Temperature
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