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参数资料
| 型号： | RFPT400TLF |
| 元件分类： | 模拟信号调理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO4 |
| 封装： | 5 X 3.20 MM, ROHS COMPLIANT PACKAGE-4 |
| 文件页数： | 2/4页 |
| 文件大小： | 112K |
| 代理商： | RFPT400TLF |
6.0
-------
PHASE NOISE
-------
Line
Parameter
Test Condition
Value
Unit
6.1
SSB phase noise
power density at 1Hz
offset
Typical values for a 19.2MHz oscillator at 25°C
-64
dBc/Hz
6.2
SSB phase noise
power density at 10Hz
offset
Typical values for a 19.2MHz oscillator at 25°C
-101
dBc/Hz
6.3
SSB phase noise
power density at
100Hz offset
Typical values for a 19.2MHz oscillator at 25°C
-120
dBc/Hz
6.4
SSB phase noise
power density at 1kHz
offset
Typical values for a 19.2MHz oscillator at 25°C
-134
dBc/Hz
6.5
SSB phase noise
power density at
10kHz offset
Typical values for a 19.2MHz oscillator at 25°C
-143
dBc/Hz
6.6
SSB phase noise
power density at
100kHz offset
Typical values for a 19.2MHz oscillator at 25°C
-143
dBc/Hz
-----
7.0
-------
JITTER
-------
Line
Parameter
Test Condition
Value
Unit
7.1
Jitter
Frequency offset from carrier 10Hz to 1MHz
1.7 max
ps
-----
8.0
-------
ENVIRONMENTAL
-------
Line
Parameter
Test Condition
8.1
Vibration
IEC 60068-2-6, test Fc. 10-60Hz 1.5 mm displacement, 60-2000Hz at 20gn, 4
hours in each of three mutually perpendicular axes at 1 octave per minute
8.2
Shock
IEC 60068-2-27, test Ea.: 1500gn acceleration for 0.5ms duration, half-sine pulse,
3 shocks in each direction along three mutually perpendicular axes
8.3
Soldering
SMD product suitable for reflow soldering. Peak temperature 260°C. Maximum time
above 220°C, 60s
8.4
RoHS
Parts are fully compliant with the European Union directive 2002/95/EC on the
restriction of the use of certain hazardous substances in electrical and electronic
equipment. Note these RoHS compliant parts are suitable for assembly using both
lead-free solders and tin/lead solders
8.5
Storage temperature
range
-55°C to 125°C
8.6
Humidity
85% for 48 hours at 85°C, non-condensing
-----
9.0
-------
MARKING
-------
Line
Parameter
Test Condition
9.1
Type
Laser marked
9.2
Line 1
R and manufacturing identifier (X XX) (see model drawing diagram)
9.3
Line 2
Pad 1/static sensitivity identifier (), abbreviated part number (0000), device date
code (YW) (see model drawing diagram)
-----
10.0
-------
MANUFACTURING INFORMATION
-------
Line
Parameter
Test Condition
10.1
Reflow
Solder reflow processes as per profile attached (see reflow profile diagram).
Solderability: MIL-STD-202, method 208, category 3
10.2
Packaging description
Part numbers with suffix 'T' will be supplied on tape and reel
-----
11.0
-------
PIN FUNCTION
-------
Line
Parameter
Test Condition
11.1
Pin
Function
11.2
1
Control voltage, Vc
11.3
2
Ground
11.4
3
Output
11.5
4
Supply voltage, Vs
11.6
NOTE
For correct operation a 10nF supply de-coupling capacitor should be placed next to
the device, see recommended PCB pattern. If an AC coupled output is required a
10nF should be placed in series with output pad 3
-------
Rakon Product Specification
Page 2
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