参数资料
型号: RFS06ZE-M6
厂商: Power-One
文件页数: 16/18页
文件大小: 0K
描述: CONV DC-DC 48V IN 3.3V OUT 19.8W
标准包装: 15
系列: RFS
类型: 隔离
输出数: 1
电压 - 输入(最小): 36V
电压 - 输入(最大): 75V
Voltage - Output 1: 3.3V
电流 - 输出(最大): 6A
电源(瓦) - 制造商系列: 20W
电压 - 隔离: 1.5kV(1500V)
安装类型: 表面贴装
封装/外壳: 18-DIP SMD 模块
尺寸/尺寸: 1.87" L x 1.00" W x 0.37" H(47.5mm x 25.4mm x 9.4mm)
包装: 托盘
工作温度: -40°C ~ 100°C
效率: 85%
电源(瓦特)- 最大: 19.8W
其它名称: 179-2203

RFS/RDS Series Data Sheet
?
20W SMT DC-DC Converters, 1.5 – 5 V Output
Mechanical Data
Dimensions in mm [inches]
Tc & pick up point
Pin 1
Tc & pick up point
Highest component
≤ 3.1 [0.122]
Surface Mount Assembly
Soldering
The following soldering instructions must be observed
to prevent failure or significant degradation of the
converter performance. Power-One will not honor any
warranty claims arising from failure to observe these
instructions.
The lead-frame is constructed for a high temperature
glass filled, UL94 V-0 flame retardant, dually ortho-
phthalate molding compound commonly used for
packaging of electronics components. It has passed
NASA outgassing tests, and is certified to MIL-M-14.
The coefficient of thermal expansion is equivalent to
FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore they
facilitate visual inspection (manual or automatic). The
leads are formed from a 97% Cu alloy plated with Ni
and matte Sn. This material is commonly used in
the manufacture of integrated circuits. It has good
corrosion resistance and exhibits the nobility inherent
to all high copper alloys. Unlike brasses, this material
is essentially immune to stress corrosion cracking. It
also exhibits excellent solderability. It is readily wetted
by solders and performs well in standard solderability
tests. (Dip of Class II or better).
The product is manufactured with a patented process,
which is fully automated and ‘in-line’. This ensures
that there is no contamination or mechanical stress on
the lead-frame so that the co-planarity and
solderability are maintained.
The product is shipped in JEDEC trays to ensure
preservation of the co-planarity and enable fully
automated assembly in the final application. Mind the
marking for pin 1!
These products are approved for forced convection
reflow soldering only. Products RoHS-compliant for all
6 substances (model designation ending with G) allow
for a solder profile with higher temperatures; see
tables below.
BCD.00017 Rev. AA, 18-Oct-2010
Page 16 of 18
www.power-one.com
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