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| 型号： | RH56D-PCI |
| 厂商： | Conexant Systems, Inc. |
| 英文描述： | Host Controlled V.90/K56flex Modem device |
| 中文描述： | 主机控制V.90/K56flex调制解调器设备 |
| 文件页数： | 4/60页 |
| 文件大小： | 357K |
| 代理商： | RH56D-PCI |
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RH56D-PCI Modem Designer’s Guide
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Conexant
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Conexant Proprietary Information
3.
HARDWARE INTERFACE ................................................................................................................................. 3-1
3.1
HARDWARE SIGNAL PINS AND DEFINITIONS..................................................................................... 3-1
3.2
POWER REQUIREMENTS AND MAXIMUM RATINGS......................................................................... 3-13
3.3
MDP ELECTRICAL CHARACTERISTICS.............................................................................................. 3-14
3.4
PCI BUS ELECTRICAL, SWITCHING, AND TIMING CHARACTERISTICS.......................................... 3-14
4.
DESIGN CONSIDERATIONS............................................................................................................................. 4-1
4.1
PC BOARD LAYOUT GUIDELINES......................................................................................................... 4-1
4.1.1
General Principles...................................................................................................................... 4-1
4.1.2
Component Placement............................................................................................................... 4-1
4.1.3
Signal Routing............................................................................................................................ 4-2
4.1.4
Power......................................................................................................................................... 4-3
4.1.5
Ground Planes........................................................................................................................... 4-4
4.1.6
Crystal Circuit............................................................................................................................. 4-4
4.1.7
VC and VREF Circuit ................................................................................................................. 4-4
4.1.8
Telephone and Local Handset Interface.................................................................................... 4-5
4.1.9
Optional Configurations ............................................................................................................. 4-5
4.1.10
MDP Specific.............................................................................................................................. 4-5
4.2
CUSTOM DESIGN GUIDELINES FOR 2-LAYER PCI MODEM BOARD................................................. 4-5
4.2.1
General Guidelines .................................................................................................................... 4-5
4.2.2
Placement of Modem Devices ................................................................................................... 4-6
4.2.3
Trace Routing and Length on PCI Signals................................................................................. 4-6
4.2.4
Grounding .................................................................................................................................. 4-6
4.2.5
Filtering ...................................................................................................................................... 4-6
4.2.6
Decoupling................................................................................................................................. 4-7
4.2.7
Crystal Circuit............................................................................................................................. 4-7
4.2.8
Modem Analog Interface............................................................................................................ 4-8
4.3
PCB LAYOUT EXAMPLES....................................................................................................................... 4-9
4.4
CRYSTAL/OSCILLATOR SPECIFICATIONS ........................................................................................ 4-11
4.5
OTHER CONSIDERATIONS.................................................................................................................. 4-11
4.6
PACKAGE DIMENSIONS....................................................................................................................... 4-14
5.
SOFTWARE INTERFACE.................................................................................................................................. 5-1
5.1
PCI CONFIGURATION REGISTERS....................................................................................................... 5-1
5.1.1
0x00 - Vendor ID Field............................................................................................................... 5-1
5.1.2
0x02 - Device ID Field................................................................................................................ 5-1
5.1.3
0x04 - Command Register......................................................................................................... 5-2
5.1.4
0x06 - Status Register ............................................................................................................... 5-2
5.1.5
0x08 - Revision ID Field............................................................................................................. 5-3
5.1.6
0x09 - Class Code Field............................................................................................................. 5-3
5.1.7
0x0D - Latency Timer Register .................................................................................................. 5-3
5.1.8
0x0E - Header Type Field.......................................................................................................... 5-3
5.1.9
0x28 - CIS Pointer Register ....................................................................................................... 5-3
5.1.10
0x2C - Subsystem Vendor ID Register...................................................................................... 5-3
5.1.11
0x2E- Subsystem ID Register.................................................................................................... 5-3
5.1.12
0x34 - Cap Ptr............................................................................................................................ 5-3
5.1.13
0x3C - Interrupt Line Register.................................................................................................... 5-3
5.1.14
0x3D - Interrupt Pin Register...................................................................................................... 5-3
5.1.15
0x3E - Min Grant Register.......................................................................................................... 5-3
5.1.16
0x3F - Max Latency Register..................................................................................................... 5-3
5.1.17
0x40 - Capability Identifier ......................................................................................................... 5-3
5.1.18
0x41 - Next Item Pointer ............................................................................................................ 5-3
5.1.19
0x42 - PMC - Power Management Capabilities ......................................................................... 5-4
5.1.20
0x44 - PMCSR - Power Management Control/Status Register (Offset = 4)............................... 5-4
5.1.21
0x46 - PMCSR_BSE - PMCSR PCI to PCI Bridge Support Extensions..................................... 5-4
5.1.22
0x47 - Data ................................................................................................................................ 5-4
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