参数资料
型号: RHEF750-AP
厂商: TE Connectivity
文件页数: 17/28页
文件大小: 0K
描述: POLYSWITCH PTC RESET 7.5A AMMO
标准包装: 1,000
系列: PolySwitch®
电流 - 维持(Ih): 7.5A
电流 - 跳闸(It): 13.1A
电流 - 最大: 100A
电压 - 最大: 16V
R最小/最大: 0.009 ~ 0.015 欧姆
跳闸时间: 7s
封装/外壳: 径向
包装: 带盒(TB)
Table R5 Physical Characteristics and Environmental Specifications for Radial-leaded Devices
RKEF
Environmental Specifications
Cont’d
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
RUEF
Physical Characteristics
Conditions
-40°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±10%
±10%
No change
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
Operation temperature
RUEF090 to RUEF250: Tin-plated copper-clad steel, 0.205mm 2 (24AWG)
RUEF300 to RUEF900: Tin-plated copper, 0.52mm 2 (20AWG), ?0.81mm (0.032in.)
Solderability per ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method1A, Condition B, can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
-40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
RUSBF
Physical Characteristics
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
Lead material
Soldering characteristics
Solder heat withstand
Insulating material
RUSBF075: Tin-plated nickel-copper alloy, 0.205mm 2 (24AWG), ?0.51mm/0.020in.
RUSBF090 to RUSBF250: Tin-plated copper clad-steel, 0.205mm 2 (24AWG), ?0.51mm/0.020in.
Solderability per ANSI/J-STD-002 Category 3 except
RUSBF075 meet ANSI/J-STD-002 Category 1
RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1A, Condition A; can withstand 5 seconds at 260°C ±5°C
All others: per IEC-STD 68-2-20, Test Tb, Method 1A, Condition B; can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Operation temperature -40°C~85°C
Note: Devices are not designed to be placed through a reflow process.
Environmental Specifications
12
Test
Passive aging
Humidity aging
Thermal shock
Solvent resistance
RoHS Compliant, ELV Compliant
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
Resistance Change
±5%
±5%
±5%
±5%
No change
151
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