参数资料
型号: RJ1206FRE073R3L
厂商: Yageo
文件页数: 7/9页
文件大小: 0K
描述: RES 3.3 OHM 1/8W 1% 1206 SMD
产品目录绘图: Thin Film Resistor Top
Thin Film Resistor Side
标准包装: 10
系列: RJ
电阻(欧姆): 3.3
功率(瓦特): 0.125W,1/8W
复合体: 薄膜
温度系数: ±50ppm/°C
容差: ±1%
封装/外壳: 1206(3216 公制)
尺寸/尺寸: 0.122" L x 0.063" W(3.10mm x 1.60mm)
高度: 0.026"(0.65mm)
端子数: 2
包装: 标准包装
其它名称: 311-3.3NDKR
Product specification
7
Chip Resistor Surface Mount
RJ
SERIES
0402 to 2512 (RoHS Compliant)
9
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Life/
Operational Life/
Endurance
High
Temperature
Exposure/
Endurance at
upper category
TEST METHOD
MIL-STD-202F-method 108A
IEC 60115- 4.25.1
JIS C 5202-7.10
MIL-STD-202F-method 108A
IEC 60115- 4.25.3
JIS C 5202-7.11
PROCEDURE
1,000 hours at 70°C ±5°C applied RCWV
1.5h on, 0.5h off, still air required
1,000 hours at maximum operating temperature
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances: 125±3 °C
REQUIREMENTS
±(1%+0.05 ? )
±(0.5%+0.05 ? )
temperature
Moisture
Resistance
MIL-STD-202F-method 106F
IEC 60115- 4.24.2
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a & 7b,
±(0.5%+0.05 ? )
unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
Thermal Shock
MIL-STD-202 Method 107
-55/+125 °C
±(0.5%+0.05 ? )
Note: Number of cycles required is 300. Devices
unmounted
Maximum transfer time is 20 seconds. Dwell time is
15 minutes. Air – Air
Short time
overload
Board Flex/
Bending
MIL-R-55342D-para 4.7.5
IEC60155-1 4.6.1.1
IEC60115-1 4.33
IEC60068-2-21 Ue1
2.5 times RCWV or maximum overload voltage
whichever is less for 5 sec at room temperature
Device mounted on PC board as described, only
1 board bending required
±(1%+0.05 ? )
±(1%+0.05 ? )
Bending : sizes ≤ 1206 : 3mm
sizes > 1206 : 2mm
Bending time: 60±5 seconds
Ohmic value checked during bending
www.yageo.com
Jul 11, 2008 V.2
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