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参数资料
| 型号： | RK80546PG0801M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3000 MHz, MICROPROCESSOR, CPGA478 |
| 封装： | 1.27 MM PITCH, FLIP CHIP, MICRO PGA-478 |
| 文件页数： | 14/80页 |
| 文件大小： | 1845K |
| 代理商： | RK80546PG0801M |
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Datasheet
21
Electrical Specifications
2.9
Absolute Maximum and Minimum Ratings
Table 8 specifies absolute maximum and minimum ratings. Within functional operation limits,
functionality and long-term reliability can be expected.
At conditions outside functional operation condition limits, but within absolute maximum and
minimum ratings, neither functionality nor long-term reliability can be expected. If a device is
returned to conditions within functional operation limits after having been subjected to conditions
outside these limits, but within the absolute maximum and minimum ratings, the device may be
functional, but with its lifetime degraded depending on exposure to conditions exceeding the
functional operation condition limits.
At conditions exceeding absolute maximum and minimum ratings, neither functionality nor long-
term reliability can be expected. Moreover, if a device is subjected to these conditions for any
length of time then, when returned to conditions within the functional operating condition limits, it
will either not function, or its reliability will be severely degraded.
Although the processor contains protective circuitry to resist damage from static electric discharge,
precautions should always be taken to avoid high static voltages or electric fields.
NOTES:
1. For functional operation, all processor electrical, signal quality, mechanical, and thermal specifications must
be satisfied.
2. Storage temperature is applicable to storage conditions only. In this scenario, the processor must not receive
a clock, and no lands can be connected to a voltage bias. Storage within these limits will not affect the long-
term reliability of the device. For functional operation, refer to the processor case temperature specifications.
3. This rating applies to the processor and does not include any tray or packaging.
2.10
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core silicon and not
at the package pins unless noted otherwise. See Chapter 4 for the pin signal definitions and signal
pin assignments. Most of the signals on the processor FSB are in the GTL+ signal group. The DC
specifications for these signals are listed in Table 12.
Previously, legacy signals and Test Access Port (TAP) signals to the processor used low-voltage
CMOS buffer types. However, these interfaces now follow DC specifications similar to GTL+. The
meeting specifications for case temperature, clock frequency, and input voltages. Care should be
taken to read all notes associated with each parameter.
MSR_PLATFORM_BRV bit 18 is a Platform Requirement Bit (PRB) that indicates that the
processor has specific platform requirements.
Table 8.
Processor DC Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Notes
V
CC
Any processor supply voltage with
respect to VSS
- 0.3
1.55
V
1
T
C
Processor case temperature
See Section 5
°C
2, 3
TSTORAGE
Processor storage temperature
–40
+85
°C
2, 3
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