参数资料
型号: RL1218JK-070R01L
厂商: Yageo
文件页数: 7/9页
文件大小: 0K
描述: RES 0.01 OHM 1W 5% 1218 SMD
标准包装: 1
系列: RL
电阻(欧姆): 0.01
功率(瓦特): 1W
复合体: 厚膜
特点: 电流检测
温度系数: ±2000ppm/°C
容差: ±5%
封装/外壳: 1812(4632 公制)宽(长端),1218(3246 公制)
尺寸/尺寸: 0.120" L x 0.181" W(3.05mm x 4.60mm)
高度: 0.026"(0.65mm)
端子数: 2
包装: 标准包装
其它名称: 0.01NBDKR
0.01NBDKR-ND
311-0.01NBDKR
Product specification
7
Chip Resistor Surface Mount
RL
SERIES
0402 to 2512
9
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Life/
Endurance
High Temperature
Exposure/
Endurance at upper
category temperature
TEST METHOD
IEC 60115-1 4.25.1
IEC 60068-2-2
PROCEDURE
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at maximum operating
temperature depending on specification,
unpowered
No direct impingement of forced air to the
REQUIREMENTS
±2%
±1%
parts
Tolerances: 125±5 °C
Moisture Resistance
MIL-STD-202G Method-106G
Each temperature / humidity cycle is defined at
±2%
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
Thermal Shock
MIL-STD-202G Method-107G
-55/+125 °C
±1%
Note: Number of cycles required is 300.
Devices unmounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
Short time overload
IEC60115-1 4.13
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
±2%
No visible damage
temperature
Board Flex/
Bending
IEC 60068-2-21
Device mounted on PCB test board as
described, only 1 board bending required
±1%
No visible damage
3 mm bending
Bending time: 60±5 seconds
Ohmic value checked during bending
www.yageo.com
Mar 22, 2010 V.5
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