参数资料
型号: RNA002-185T
厂商: ADVANCED INTERCONNECTIONS CORP
元件分类: 插座
英文描述: SIP2, IC SOCKET
文件页数: 2/4页
文件大小: 297K
代理商: RNA002-185T
SIP Sockets
Molded and Peel-A-Way
SIP Sockets
5 Energy Way, West Warwick, RI 02893 USA
Tel: 800.424.9850 | 401.823.5200
Fax: 401.823.8723
info@advanced.com | www.advanced.com
Cat. 16 Rev. 1
Products shown covered by patents issued and/or pending. Specifications subject to change without notice.
inch/(mm)
.058 Dia.
(1.47)
.034 Dia.
(.86)
.015
(.38)
.155
(3.94)
Type -210
Peel-A-Way
Surface Mount Sockets
Surface Mount Top/Bottom
PC Board
.072 Dia.
(1.83)
.028 Dia.
(.71)
.021 Hole
(.53) Dia.
.095
(2.41)
.095
(2.41)
.058 Dia.
(1.47)
.038 Dia.
(.97)
.155
(3.94)
.031
(.79)
.072 Dia.
(1.83)
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
Standard Quick-Turn Terminals
Type -51
Type -04
Type -49
Type -01
.072 Dia.
(1.83)
.020 Dia.
(.51)
.110
(2.79)
.130
(3.30)
.058 Dia.
(1.47)
.155
(3.95)
.031
(.79)
.034 Dia.
(.86)
.072 Dia.
(1.83)
.028 Dia.
(.71)
.120
(3.05)
.110
(2.79)
.020 Dia.
(.51)
.125
(3.18)
.165
(4.19)
.145
(3.68)
.072 Dia.
(1.83)
Type -33
Type -85
Type -176
Additional standard and custom terminals available.
See Terminals section online or consult factory.
Not for use with head above
Molded only
Peel-A-Way only
Solder Preform Terminals
.072 Dia.
(1.83)
.020 Dia.
(.51)
.110
(2.79)
.130
(3.30)
Solder
Preform
.072 Dia.
(1.83)
.165
(4.19)
.125
(3.18)
.020 Dia.
(.51)
Solder
Preform
.058 Dia.
(1.47)
.038 Dia.
(.97)
.155
(3.94)
.031
(.79)
Solder
Preform
Tin/Lead: Type -150
Tin/Lead: Type -151
Tin/Lead: Type -111
PC Board
Preform After
Solder Flow
Solder Preform
Intrusive Reflow Application
Combines the labor of socket loading and solder
application into one operation.
Eliminates the use of solder paste and screening
operation.
Eliminates solder bridges and/or solder shorts
due to excess solder.
Ensures a reliable solder joint with controlled
solder volume.
Ideal for surface mount and mixed technology
applications.
For custom solder preform terminal applications
consult factory.
Lead-free: Type -811
Lead-free: Type -812
Lead-free: Type -810
Peel-A-Way only
Available Online:
RoHS Qualification Test Report
Features:
Sockets surface mount to PCB.
Suppplied in high temperature
Peel-A-Way socket terminal
carrier.
Peel-A-Way carrier can be left in
place for added stability.
High reliability screw-machined
terminals with multiple finger
beryllium copper contacts.
Available with solder preforms.
Surface Mount Applications:
相关PDF资料
PDF描述
RT075-144GT RELAY SOCKET
RDL306-31MT DIP6, IC SOCKET
RDS964-51GG3M DIP64, IC SOCKET
RIS065-01GG3M PGA65, IC SOCKET
RLS618-51GG3M DIP18, IC SOCKET
相关代理商/技术参数
参数描述
RNA008-08G 制造商:Advanced Interconnect 功能描述:
RNA010-43G 制造商:Advanced Interconnect 功能描述:
RNA420-80 制造商:AVK 功能描述:
RNA4A8E100JT 功能描述:RES ARRAY 10 OHM 8 RES 1608 RoHS:是 类别:电阻器 >> 网络、阵列 系列:RNA4A, Kyocera 标准包装:25 系列:MDP 电路类型:隔离 电阻(欧姆):330 电阻数:7 引脚数:14 每个元件的功率:250mW 容差:±2% 温度系数:±100ppm/°C 应用:- 安装类型:通孔 封装/外壳:14-DIP(0.300",7.62mm) 供应商设备封装:DIP 尺寸/尺寸:0.750" L x 0.310" W(19.05mm x 7.87mm) 高度:0.155"(3.94mm) 包装:管件 工作温度:-55°C ~ 125°C 其它名称:MDP1403330RGE04-NDMDP330B
RNA4A8E101JT 功能描述:RES ARRAY 100 OHM 8 RES 1608 RoHS:是 类别:电阻器 >> 网络、阵列 系列:RNA4A, Kyocera 标准包装:25 系列:MDP 电路类型:隔离 电阻(欧姆):330 电阻数:7 引脚数:14 每个元件的功率:250mW 容差:±2% 温度系数:±100ppm/°C 应用:- 安装类型:通孔 封装/外壳:14-DIP(0.300",7.62mm) 供应商设备封装:DIP 尺寸/尺寸:0.750" L x 0.310" W(19.05mm x 7.87mm) 高度:0.155"(3.94mm) 包装:管件 工作温度:-55°C ~ 125°C 其它名称:MDP1403330RGE04-NDMDP330B