参数资料
型号: RNS02ZG-M6
厂商: Power-One
文件页数: 13/16页
文件大小: 0K
描述: CONV DC-DC 48V IN 5V OUT 10W
标准包装: 15
系列: RNS
类型: 隔离
输出数: 1
电压 - 输入(最小): 38V
电压 - 输入(最大): 75V
Voltage - Output 1: 5V
电流 - 输出(最大): 2A
电源(瓦) - 制造商系列: 10W
电压 - 隔离: 1.5kV(1500V)
安装类型: 表面贴装
封装/外壳: 18-DIP SMD 模块
尺寸/尺寸: 1.87" L x 1.00" W x 0.34" H(47.5mm x 25.4mm x 8.6mm)
包装: 托盘
工作温度: -45°C ~ 110°C
效率: 83%
电源(瓦特)- 最大: 10W
其它名称: 179-2211
RNS DC-DC Series Data Sheet
10W SMT Converter ? Wide Input ? 2.5V to 15V
Surface Mount Assembly
Soldering:
Max. temp. on pins 1 and 10 during reflow
soldering (deg C)
The following instructions must be observed when
soldering the unit. Failure to observe these
instructions may result in failure or significant
degradation of the module performance. Power-One
will not honor any warranty claims arising from failure
to observe these instructions.
This product is approved for forced convection reflow
soldering only.
300
250
200
150
100
50
Peak Temperature
(See fig below)
tp
The curves below define the maximum peak reflow
temperature permissible measured on Pins 1 and 10
of the converter.
0
190 – 450 s
Time (s)
The lead-frame is constructed from a high
temperature glass filled, UL94V0 flame retardant,
diallyl ortho-phthalate moulding compound commonly
used for packaging of electronics components. It has
passed NASA outgassing tests and is certified to MIL-
M-14. The coefficient of thermal expansion is
equivalent to FR4.
The gull wing leads are formed to ensure optimal
solder joint strength and structure. Furthermore they
facilitate visual inspection (manual or automatic). The
leads are formed from a 97% Cu alloy plated with Cu
Restriction curve above 215oC
Peak temp. at pins 1 and 10 (oC)
245
240
235
230
225
220
215
210
205
200
and Sn 90. This material is commonly used in the
10
20
30
40
50
60
manufacture of integrated circuits. It has good
corrosion resistance and exhibits the nobility inherent
Pick & Place Assembly:
tp (s)
to all high copper alloys. Unlike brasses, this material
is essentially immune to stress corrosion cracking. It
also exhibits excellent solderability. It is readily
wetted by solders and performs well in standard
solderability tests. (Dip of Class II or better).
The product is manufactured with a patented process,
which is fully automated, and ‘in-line’. This ensures
that there is no contamination or mechanical stress
on the lead-frame so that the co planarity and
solderability are maintained.
The product is shipped in JEDEC trays to ensure
preservation of the co-planarity and enable fully
automated assembly in the final application (within
0.1mm).
.
The product is designed with a large flat area in the
center of the top surface to serve as a pick up point for
automated vacuum pick and place equipment. The
‘open board’ construction of the unit ensures that weight
is kept to a minimum. However due to the relatively large
size of the component, a large nozzle (> 8.0mm,
depending on vacuum pressure) is recommended for
picking and placing.
The unit may also be automatically handled using ‘odd-
form’ placement equipment, with mechanical grippers.
For this type of equipment the end edges of the device,
which have no leads and also feature the greatest
dimensional accuracy, should be used as pick-up points.
APR 19, 2006 revised to JUN 29, 2006
Page 13 of 16
www.power-one.com
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