参数资料
型号: RP-21225F1-590
厂商: DATA DEVICE CORP
元件分类: 模拟信号调理
英文描述: SPECIALTY ANALOG CIRCUIT, XMA20
封装: PLASTIC, FP-20
文件页数: 7/20页
文件大小: 228K
代理商: RP-21225F1-590
Bias Supply- External 5V power supply used to power the SSPC inter-
nal circuitry.
BIT- Built In Test.
Coordination- If one or more SSPC's are placed in a series circuit, the
SSPC with the lowest rated current will trip first during an over cur-
rent condition.
Dielectric Strength- The breakdown voltage rating, in Vrms, of an elec-
trical isolation barrier.
EMI- Electromagnetic Interference.
I2T- Expression that evaluates to a constant value. This constant defines
the trip time of the SSPC for any over current except those that would
cause an instant trip.
Instant Trip- Condition where the SSPC trips immediately without fol-
lowing the I2T curve. This occurs when the SSPC load current
exceeds a predefined value.
Isolation- The D.C. resistance of an electrical isolation barrier, mea-
sured with a known D.C. potential.
Leakage Current- The current that flows into the load when the SSPC
is in the off state.
Lockout Control- Provides safe maintenance. When the lockout control
is in the active state, the SSPC must be off and shall not respond to
the control input.
Max Load Capacitance- Exceeding this load capacitance value may
cause unwanted tripping.
MOSFET- Metal Oxide Semiconductor Field Effect Transistor.
On Resistance- Effective resistance in ohms of the SSPC between the
Power In and Power Out pins when the SSPC is turned on.
Power Dissipation- Power in watts dissipated by the SSPC. Measured
as ( VBias x IBias ) + ( Voltage Drop x Load Current ).
Rated Current- Maximum load current where the SSPC will operate
continuously without tripping.
SSPC- Solid-State Power Controller
Sympathetic Tripping- Where any SSPC in a system can cause any
other SSPC in the system to trip abnormally. ( ie. Path through FET
parasitic diode or induction transients ) Sympathetic tripping is not
desirable.
Thermal Resistance- A measure of resistance to heat transfer. Allows
calculation of a device’s temperature rise above its mounting surface.
Specified in °C/W.
Thermal Memory- The ability of an SSPC to account for the thermal
energy retained in a wire or device.
Voltage Drop- Maximum voltage measured between the Power In and
Power Out pins with the Power Controller operating at its Rated
Current.
GLOSSARY
12
3
20
STAR Series
RP-212XXXX-XXX
S/N
0201
9861
(USA)
TM
12
3
20
Pin #
Function
1
Power out
2
Power in
4
3
Chassis ground (base)
VBias supply input
5
Not connected (Battle Short option)
6
Lock-out input
7
Status 1 output
8
Control command input
9
Status 2 output
10
Reference voltage input for optional current monitor
11
Bias supply common input
12
Optional current monitor output voltage
13
Not connected
14
Load detection program input (R2)
15
Instant Trip (R3) program Input
16
Programming reference
17
Current range program input (R1)
18
I2 current range preset input
19
I3 current range preset input
20
Slew control input
FIGURE 9. PIN-OUT DETAILS
NOTES:
1. Prototype units S/N 100-104 RP-21225F1-300P have pins numbered clock-
wise. Reference RP-212XX data sheet 01/16/99 or earlier.
2. Figure 9 is now effective for all RP-21225 after S/N 104.
15
Data Device Corporation
www.ddc-web.com
RP-21200
D-02/04-0
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