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参数资料
| 型号： | RPER71H225K2K1C60B |
| 厂商： | Murata Electronics North America |
| 文件页数： | 29/57页 |
| 文件大小： | 0K |
| 描述： | CAP CER 2.2UF 50V 10% RADIAL |
| 标准包装： | 500 |
| 系列： | RPE |
| 电容： | 2.2µF |
| 电压 - 额定： | 50V |
| 容差： | ±10% |
| 温度系数： | X7R |
| 安装类型： | 通孔 |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 通用 |
| 封装/外壳： | 径向 |
| 尺寸/尺寸： | 0.217" L x 0.124" W（5.50mm x 3.15mm） |
| 高度 - 座高（最大）： | 0.197"（5.00mm） |
| 引线间隔： | 0.197"（5.00mm） |
| 包装： | 散装 |
| 引线型： | 扁平弯曲 |
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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations. Therefore, please approve our product speci?cations or transact the approval sheet for product speci?cations before ordering.
C49E.pdf
Mar.12,2014
Speci?cations and Test Methods
Continued from the preceding page.
Specification
No. AEC-Q200 Test Item Temperature Compensating Type High Dielectric Constant Type
AEC-Q200 Test Method
(Char. X8G)
Appearance No defects or abnormalities
(Char. X8L)
Per MIL-STD-202 Method 215
Capacitance Within the specified tolerance
Solvent 1: 1 part (by volume) of isopropyl alcohol
3 parts (by volume) of mineral spirits
2
10
Resistance Q/D.F.
to Solvents
Q U 1,000
0.025 max.
Solvent 2: Terpene defluxer
Solvent 3: 42 parts (by volume) of water
I.R.
More than 10,000M Ω or 500M Ω · μF (Whichever is smaller)
1 part (by volume) of propylene glycol
monomethyl ether
1 part (by volume) of monoethanolamine
Appearance No defects or abnormalities
Three shocks in each direction should be applied along 3
11
Mechanical Capacitance Within the specified tolerance
Shock
Q/D.F. Q U 1,000
0.025 max.
mutually perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should
have a duration: 0.5ms, peak value: 1,500G and velocity
change: 4.7m/s.
12 Vibration
Appearance No defects or abnormalities
Capacitance Within the specified tolerance
The capacitor should be subjected to a simple harmonic motion
having a total amplitude of 1.5mm, the frequency being varied
uniformly between the approximate limits of 10 and 2,000Hz.
The frequency range, from 10 to 2,000Hz and return to 10Hz,
Q/D.F.
Q U 1,000
0.025 max.
should be traversed in approximately 20min. This motion
should be applied for 12 items in each 3 mutually perpendicular
directions (total of 36 times).
Resistance to
Soldering Heat
The measured and observed characteristics should satisfy the
specifications in the following table.
The lead wire is immersed in the melted solder 1.5 to 2mm
Appearance No defects or abnormalities
from the main body at 260±5°C for 10±1s. The specified items
13
Capacitance Within ±2.5% or ±0.25pF
Change (Whichever is larger)
Dielectric
Strength
No defects
(Between
Within ±7.5%
are measured after 24±2h.
Perform the heat treatment at 150+0/-10°C for 60±5 min and
then let sit for 24±2h at *room condition. (for Char. X8L)
Terminals)
Thermal Shock
The measured and observed characteristics should satisfy the
specifications in the following table.
Perform the 300 cycles according to the two heat treatments
listed in the following table (Maximum transfer time is 20s.).
Appearance No defects or abnormalities
Let sit for 24±2h at *room condition, then measure.
14
Capacitance Within ±5% or ±0.5pF
Change (Whichever is larger)
Q/D.F. Q U 350
Within ±12.5%
0.05 max.
Step
Temp. (°C)
Time (min.)
1
-55+0/-3
15±3
2
150+3/-0
15±3
I.R.
1,000M Ω or 50M Ω · μF min. (Whichever is smaller)
Perform the heat treatment at 150+0/-10°C for 60±5min and
then let sit for 24±2h at *room condition. (for Char. X8L)
Appearance No defects or abnormalities
Capacitance Within the specified tolerance
15 ESD
Q/D.F.
Q U 1,000
0.025 max.
Per AEC-Q200-004
I.R.
More than 10,000M Ω or 500M Ω · μF (Whichever is smaller)
The terminal of a capacitor is dipped into a solution of ethanol
(JIS-K-8101) and rosin (JIS-K-5902) (25%rosin in weight
propotion) and then into molten solder (JIS-Z-3282) for
16 Solderability
Lead wire should be soldered with uniform coating on the axial
direction over 95% of the circumferential direction.
2±0.5 sec. In both cases the depth of dipping is up to about
1.5 to 2mm from the terminal body.
Temp. of solder:
245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
235±5°C H60A or H63A Eutectic Solder
* “room condition” Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmosphere pressure: 86 to 106kPa
Continued on the following page.
27
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