参数资料
型号: RT1206DRD079K09L
厂商: Yageo
文件页数: 8/10页
文件大小: 0K
描述: RES 9.09K OHM 1/4W .5% SMD 1206
标准包装: 5,000
系列: RT
电阻(欧姆): 9.09k
功率(瓦特): 0.25W,1/4W
复合体: 薄膜
温度系数: ±25ppm/°C
容差: ±0.5%
封装/外壳: 1206(3216 公制)
尺寸/尺寸: 0.122" L x 0.063" W(3.10mm x 1.60mm)
高度: 0.026"(0.65mm)
端子数: 2
包装: 带卷 (TR)
Product specification
8
Chip Resistor Surface Mount
RT
SERIES
0402 to 2512 (RoHS Compliant)
10
TEST
Short Time Overload
Board Flex/
Bending
TEST METHOD
IEC60115-1 4.13
IEC 60068-2-21
PROCEDURE
2.5 times of rated voltage or maximum
overload voltage whichever is less for 5 sec at
room temperature
Chips mounted on a 90mm glass epoxy resin
PCB (FR4)
REQUIREMENTS
±(0.5%+0.05 ? )
No visible damage
±(0.25%+0.05 ? )
No visible damage
Bending: see table 6 for each size
Bending time: 60±5 seconds
Low Temperature
Operation
IEC 60068-2-1
The resistor shall be subjected to a DC rated
voltage for 1.5 h-on, 0.5 h-off, at -55±3 °C
This constitutes shall be repeated for 96 hours
±(0.5%+0.05 ? )
No visible damage
However the applied voltage shall not exceed
the maximum operating voltage
Insulation Resistance
IEC 60115-1 4.6
Rated continuous overload voltage (RCOV)
≥ 10 G ?
for 1 minute
Details see below table 5
Dielectric Withstand
Voltage
IEC 60115-1 4.7
Maximum voltage (V rms ) applied for 1 minute
Details see below table 5
No breakdown or flashover
Solderability
- Wetting
IPC/JEDEC J-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
Well tinned ( ≥ 95%
covered)
No visible damage
1 st step: method B, aging 4 hours at 155°C
dry heat
2 nd step: leadfree solder bath at 245±3°C
Dipping time: 3±0.5 seconds
- Leaching
IPC/JEDEC J-STD-002B test D
Leadfree solder, 260 °C, 30 seconds
No visible damage
immersion time
- Resistance to
Soldering Heat
IEC 60068-2-58
Condition B, no pre-heat of samples.
Leadfree solder, 260 °C, 10 seconds
immersion time
±(0.5%+0.05 ? )
No visible damage
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
www.yageo.com
Oct 21, 2009 V.4
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