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参数资料
| 型号： | S2025C-15 |
| 厂商： | APPLIEDMICRO INC |
| 元件分类： | 数字信号处理外设 |
| 英文描述： | 32-BIT, DSP-CROSSBAR SWITCH, PQFP196 |
| 封装： | LDCC-196 |
| 文件页数： | 4/17页 |
| 文件大小： | 126K |
| 代理商： | S2025C-15 |
12
32 x 32 1.5 GBIT/S DIFFERENTIAL CROSSPOINT SWITCH
S2025
June 24, 1999 / Revision B
THERMAL MANAGEMENT GUIDELINES
Because of the relatively high power dissipation of the
S2025 device, thermal management is a key design
consideration. The junction temperature (Tj) of the
device must not exceed 150
°C for it to operate within its
specifications. There are a number of ways to imple-
ment thermal management, depending upon the system
requirements and applications. AMCC is offering the
following two methods as guidelines to ensure proper
operation of the S2025.
1.
Convection—Heat Sink with Forced Air Flow
AMCC offers the standard heat sink 45–17 for
impingement cooling (air flow forced directly to the
face of the heat sink). This method is similar to the
fan/heat-sink devices used on new, high-perfor-
mance, and high-power microprocessors. The
dimensions of the heat sink are given in Figure 6.
Considering the junction-to-case, and case-to-
ambient thermal resistivities, one can estimate the
amount of required air flow and the maximum
ambient temperature (Ta) in order to keep the Tj
below the critical limit of 150
°C. Table 4 lists these
values for 45-17 and 45-24 heat sinks when Tj =
150
°C.
2.
Conduction—Liquid Cooling Methods
Passive cooling schemes, such as Aavid
Engineering’s Oasis technology may also be used
to ensure low junction temperature. Oasis uses
Flourinert, a liquid that boils around 57
°C, to transfer
heat from the hot device to a condenser, where the
vaporized Flourinert is cooled, becomes liquid again,
and returns to the hot device. The S2025 case
temperature would not exceed 57
°C, as long as the
cooling system is functioning properly. In such
case, using the following equation, one could calcu-
late the maximum anticipated Tj to be around 85°C.
Tj = Tc + (Pd x 2)
(Tc is the case temperature in
°C, and
Pd is the dissipated power in Watts.)
For more information on Oasis technology, please
contact:
Aavid Engineering Incorporated
Oasis Products Group
One Kool Path/P.O. Box 400
Laconia, NH 03247-0400
Tel:
603/528-3400
FAX: 603/528-1478
Table 4. Maximum Ambient Temperatures
T
a
)
x
a
m
(
C
)
7
1
-
5
4
S
/
H
(
)
M
P
F
L
(
w
o
l
F
r
i
A
0
30
0
2
0
50
0
4
0
60
0
6
0
70
0
8
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相关代理商/技术参数 |
参数描述 |
|---|---|
| S2025L | 功能描述:SCR 25A 200V RoHS:否 制造商:STMicroelectronics 最大转折电流 IBO:480 A 额定重复关闭状态电压 VDRM:600 V 关闭状态漏泄电流（在 VDRM IDRM 下）:5 uA 开启状态 RMS 电流 (It RMS): 正向电压下降:1.6 V 栅触发电压 (Vgt):1.3 V 最大栅极峰值反向电压:5 V 栅触发电流 (Igt):35 mA 保持电流（Ih 最大值）:75 mA 安装风格:Through Hole 封装 / 箱体:TO-220 封装:Tube |
| S-2025L | 制造商:LITTELFUSE 制造商全称:Littelfuse 功能描述:RoHS Compliant, Electrically-isolated package |
| S2025L | 制造商:Littelfuse 功能描述:SCR Thyristor |
| S2025L | 制造商:Littelfuse 功能描述:THYRISTOR 200V 25A TO-220IS |
| S2025L_ | 功能描述:SCR USE 576-S2025L RoHS:否 制造商:STMicroelectronics 最大转折电流 IBO:480 A 额定重复关闭状态电压 VDRM:600 V 关闭状态漏泄电流（在 VDRM IDRM 下）:5 uA 开启状态 RMS 电流 (It RMS): 正向电压下降:1.6 V 栅触发电压 (Vgt):1.3 V 最大栅极峰值反向电压:5 V 栅触发电流 (Igt):35 mA 保持电流（Ih 最大值）:75 mA 安装风格:Through Hole 封装 / 箱体:TO-220 封装:Tube |
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