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参数资料
| 型号： | S26MD01 |
| 厂商： | SHARP ELECTRONICS CORP |
| 元件分类： | 继电器，输入/输出模块 |
| 英文描述： | TRIGGER OUTPUT SOLID STATE RELAY, 4000 V ISOLATION-MAX |
| 封装： | DIP-8 |
| 文件页数： | 4/5页 |
| 文件大小： | 78K |
| 代理商： | S26MD01 |
S16MD01/S16MD02/S26MD01/S26MD02
Forward current I F ( mA )
Turn-on
time
t
on
(
s
)
3
4
5
10
20
30
40
50
100
2
10
20
Ambient temperature T a (C)
Zero-cross
voltage
V
OX
(V
)
- 30
0
20
40
60
80
100
15
20
25
Load
ZS
SSR
2
3
8
6
D1
R1
+ VCC
(1) DC Drive
(2) Pulse Drive
s Basic Operation Circuit
Fig.11 Turn-on Time vs. Forward Current
Fig.12 Zero-cross Voltage vs.
ZS : Surge absorption circuit
s Precautions for Use
1) All pins must be soldered since they are also used as heat sinks ( heat radiation fins) . In
designing, consider the heat radiation from the mounted SSR.
2) For higher radiation efficiency that allows wider thermal margin, secure a wider round
must be as small as possible. Pulling the gate pattern around increases the change of being
affected by external noise.
(S16MD02/S26MD02)
AC 100V (S16MD01/S16MD02)
AC 200V (S26MD01/S26MD02)
Notes 1 ) If large amount of surge is loaded onto V CC or the driver circuit, add a diode D 1 between terminal 2
2 ) Be sure to install a surge absorption circuit.
An appropriate circuit must be chosen according to the load
( for CR, choose its constant ) . This must be
carefully done especially for an inductive load.
more than 30mA.
3 ) For phase control, adjust such that the load current immediately after the input signal is applied will be
VI
Tr1
Load : R
AC supply voltage
Input signal
Load current
(for resistance load)
(3) Phase Control
and 3 to prevent reverse bias from being applied to the infrared LED.
pattern for Pin No.8 when designing mounting pattern. The rounded part of Pin No.5 ( gate )
Ambient Temperature
VD=6V
RL= 100
Ta= 25C
IF= 15mA
3) As for other general cautions, refer to the chapter“Precautions for Use”
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