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参数资料
| 型号： | S29CD016G0JDEI007 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | 512K X 32 FLASH 2.7V PROM, 67 ns, UUC76 |
| 封装： | 7.44 X 4.46 MM, DIE-76 |
| 文件页数： | 3/15页 |
| 文件大小： | 437K |
| 代理商： | S29CD016G0JDEI007 |
October 21, 2005 S29CD016G_KGD_A1
S29CD016G Known Good Die
11
Su ppl em ent
Operating Ranges
Ambient Temperature (TA), Industrial Range . . . . . . . . . . . . . –40°C to +85°C
Ambient Temperature (TA), Extended Range . . . . . . . . . . . . –40°C to +125°C
Ambient Temperature (TA), Hot Range . . . . . . . . . . . . . . . . –40°C to +150°C
VCC Supply Voltage for regulated voltage range . . . . . . . . . . . . 2.5 V to 2.75 V
VIO Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.65 V to 2.75 V
Note: Operating ranges define those limits between which the functionality of the de-
vice is guaranteed.
Physical Specifications
Die dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.44 x 4.46 mm
Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 750 or 500 m
Bond Pad Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86 x 86 m
Pad Area Free of Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6,724 m2
Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Al/Cu
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . SiN/SOG/SiN
Manufacturing Information
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Spansion
Test
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Spansion
Manufacturing ID
(Top Boot) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98P04AK
(Bottom Boot) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98P04ABK
Preparation for Shipment . . . . . . . . . . . . . . . . . . . . . . . . . Penang, Malaysia
Fabrication Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . CS59LS
Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Special Handling Instructions
Processing
Do not expose KGD products to ultraviolet light or process them at temperatures
greater than 250°C. Failure to adhere to these handling instructions will result in
irreparable damage to the devices. For best yield, Spansion recommends assem-
bly in a Class 10K clean room with 30% to 60% relative humidity.
Storage
Store at a maximum temperature of 30°C in a nitrogen-purged cabinet or vac-
uum-sealed bag. Observe all standard ESD handling procedures.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| S29CD016G0JFAA000 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:32 Megabit (1M x 32-Bit), 16 Megabit (512K x 32-Bit) 2.5 Volt-only Burst Mode, Dual Boot, Simultaneous Read/ Write Flash Memory with VersatileI/O |
| S29CD016G0JFAA002 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:32 Megabit (1M x 32-Bit), 16 Megabit (512K x 32-Bit) 2.5 Volt-only Burst Mode, Dual Boot, Simultaneous Read/ Write Flash Memory with VersatileI/O |
| S29CD016G0JFAA010 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:32 Megabit (1M x 32-Bit), 16 Megabit (512K x 32-Bit) 2.5 Volt-only Burst Mode, Dual Boot, Simultaneous Read/ Write Flash Memory with VersatileI/O |
| S29CD016G0JFAA012 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:32 Megabit (1M x 32-Bit), 16 Megabit (512K x 32-Bit) 2.5 Volt-only Burst Mode, Dual Boot, Simultaneous Read/ Write Flash Memory with VersatileI/O |
| S29CD016G0JFAA100 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:32 Megabit (1M x 32-Bit), 16 Megabit (512K x 32-Bit) 2.5 Volt-only Burst Mode, Dual Boot, Simultaneous Read/ Write Flash Memory with VersatileI/O |
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