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参数资料
型号： S29GL032A11BFIR42
厂商： SPANSION LLC
元件分类： PROM
英文描述： 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
中文描述： 2M X 16 FLASH 3V PROM, 110 ns, PBGA48
封装： 8.15 X 6.15 MM, LEAD FREE, FBGA-48
文件页数： 11/95页
文件大小： 3585K
代理商： S29GL032A11BFIR42
May 21, 2008 S29GL-A_00_A12
S29GL-A
19
Data
She e t
6.
Ordering Information
6.1
S29GL016A Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid
Combination) is formed by a combination of the following:
Notes
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can be packed in Types 0, 2, or 3.
2. TSOP package marking omits packing type designator from ordering part number.
3. BGA package marking omits leading S29 and packing type designator from ordering part number.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S29GL016A
10
T
A
I
R1
0
Packing Type
0= Tray
2
= 7-inch Tape and Reel
3
= 13-inch Tape and Reel
Model Number
R1 = x8/x16, VCC=3.0 – 3.6 V, Top boot sector device, top two address sectors protected
when WP#/ACC=VIL
R2 = x8/x16, VCC=3.0 – 3.6 V, Bottom boot sector device, bottom two address sectors
protected when WP#/ACC=VIL
01 = x8/x16, Vcc = 2.7 - 3.6 V, Top boot sector device, top two address sectors protected
when WP#/ACC = VIL
02 = x8/x16, Vcc = 2.7 - 3.6 V, Bottom boot sector device, bottom two address sectors
protected when WP#/ACC = VIL
W1= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, top boot sector device*
W2= x16, VCC=2.7 – 3.6 V, 56-ball FBGA, bottom boot sector device*
*W1 and W2 are MCP-compatible packages for cellular handsets only
Temperature Range
I
= Industrial (–40°C to +85°C)
Package Material Set
A = Standard
F
= Pb-Free
Package Type
T
= Thin Small Outline Package (TSOP) Standard Pinout
B = Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
Speed Option
See Product Selector Guide on page 9 and Valid Combinations below
Device Number/Description
S29GL016A
3.0 Volt-only, 16 Megabit Page-Mode Flash Memory Manufactured on 200 nm MirrorBit
Process Technology.
Table 6.1 S29GL016A Ordering Options
S29GL016A Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type (Note 1)
S29GL016A
90, 10
TAI, TFI
R1, R2
0, 3
TS048 (Note 2)
TSOP
BAI, BFI
0, 2, 3
VBK048 (Note 3)
Fine-Pitch BGA
FAI, FFI
LAA064 (Note 3)
Fortified BGA
10
BAI, BFI
W1, W2
VBU056 (Note 3)
Fine-Pitch BGA
(For cellular handsets only)
10
TAI, TFI
01, 02
0, 3
TS048 (Note 2)
TSOP
BAI, BFI
0, 2, 3
VBK048 (Note 3)
Fine-Pitch BGA
FAI, FFI
LAA064 (Note 3)
Fortified BGA
相关PDF资料
PDF描述
S29GL032A11BFIR43 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR20 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR22 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR23 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A90TAIR30 64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
相关代理商/技术参数
参数描述
S29GL032A11BFIR43 制造商:SPANSION 制造商全称:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A11FAIR10 制造商:SPANSION 制造商全称:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A11FAIR11 制造商:SPANSION 制造商全称:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A11FAIR12 制造商:SPANSION 制造商全称:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
S29GL032A11FAIR13 制造商:SPANSION 制造商全称:SPANSION 功能描述:64 MEGABIT 32MEGABIT 3.0 BOLT ONLY PAGE MODE FLASH MEMORY
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