参数资料
型号: S29GL032M10BAIR30
厂商: SPANSION LLC
元件分类: PROM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封装: 8 X 9 MM, FBGA-48
文件页数: 27/116页
文件大小: 6024K
代理商: S29GL032M10BAIR30
16
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B8 February 7, 2007
Data
Sheet
Ordering Information: S29GL032M
S29GL032M Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid Combination)
is formed by a combination of the following:
This product has been retired and is not recommended for designs. For new and current designs, S29GL032A supersedes S29GL032M, and is the
factory-recommended migration path. Please refer to the S29GL-A Datasheet for specifications and ordering information.
S29GL032M
10
T
A
I
R1
0
PACKING TYPE
0= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
R0
= x8, VCC=3.0-3.6V, Uniform sector device
R1
= x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address sector
protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
R3
= x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R4
= x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two
address sectors protected when WP#/ACC=VIL
TEMPERATURE RANGE
I
= Industrial (–40
°C to +85°C)
C
= Commercial (0
°C to +70°C)
PACKAGE MATERIAL SET
A= Standard
F
= Pb-Free
B= Standard
C
= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL032M
32 Megabit Page-Mode Flash Memory Manufactured using 0.23 m MirrorBit
Process Technology, 3.0 Volt-only Read, Program, and Erase
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S29GL032M10BAIR42 Conductive Polymer Chip Capacitors / T520 Series - High Temperature; Capacitance [nom]: 33uF; Working Voltage (Vdc)[max]: 6.3V; Capacitance Tolerance: +/-20%; Dielectric: Conductive Polymer; Lead Style: Surface-Mount Chip; Lead Dimensions: 3528-21; Termination: Solder Coated (SnPb, Pb 5% min); Body Dimensions: 3.5mm x 2.8mm x 1.9mm; Temperature Range: -55C to +125C; Container: Tape & Reel; Qty per Container: 2,000; Features: Low Temperature
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S29GL032M10BAIR32 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BAIR33 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BAIR40 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology
S29GL032M10BAIR42 制造商:Spansion 功能描述:FLASH PARALLEL 3V/3.3V 32MBIT 4MX8/2MX16 100NS 48FBGA - Tape and Reel
S29GL032M10BAIR43 制造商:SPANSION 制造商全称:SPANSION 功能描述:3.0 Volt-only Page Mode Flash Memory featuring 0.23 um MirrorBit process technology