参数资料
型号: S29GL032M10BAIR43
厂商: SPANSION LLC
元件分类: PROM
英文描述: MirrorBit Flash Family
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封装: 8 X 9 MM, FBGA-48
文件页数: 27/116页
文件大小: 6024K
代理商: S29GL032M10BAIR43
16
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B8 February 7, 2007
Data
Sheet
Ordering Information: S29GL032M
S29GL032M Standard Products
Standard products are available in several packages and operating ranges. The order number (Valid Combination)
is formed by a combination of the following:
This product has been retired and is not recommended for designs. For new and current designs, S29GL032A supersedes S29GL032M, and is the
factory-recommended migration path. Please refer to the S29GL-A Datasheet for specifications and ordering information.
S29GL032M
10
T
A
I
R1
0
PACKING TYPE
0= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
MODEL NUMBER
R0
= x8, VCC=3.0-3.6V, Uniform sector device
R1
= x8/x16, VCC=3.0-3.6V, Uniform sector device, highest address sector
protected when WP#/ACC=VIL
R2
= x8/x16, VCC=3.0-3.6V, Uniform sector device, lowest address sector
protected when WP#/ACC=VIL
R3
= x8/x16, VCC=3.0-3.6V, Top boot sector device, top two address sectors
protected when WP#/ACC=VIL
R4
= x8/x16, VCC=3.0-3.6V, Bottom boot sector device, bottom two
address sectors protected when WP#/ACC=VIL
TEMPERATURE RANGE
I
= Industrial (–40
°C to +85°C)
C
= Commercial (0
°C to +70°C)
PACKAGE MATERIAL SET
A= Standard
F
= Pb-Free
B= Standard
C
= Pb-Free
PACKAGE TYPE
T
= Thin Small Outline Package (TSOP) Standard Pinout
B
= Fine-pitch Ball-Grid Array Package
F
= Fortified Ball-Grid Array Package
SPEED OPTION
See Product Selector Guide and Valid Combinations
DEVICE NUMBER/DESCRIPTION
S29GL032M
32 Megabit Page-Mode Flash Memory Manufactured using 0.23 m MirrorBit
Process Technology, 3.0 Volt-only Read, Program, and Erase
相关PDF资料
PDF描述
S29GL032M10BFIR42 MirrorBit Flash Family
S29GL032M10BFIR32 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 330uF; Working Voltage (Vdc)[max]: 4V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR40 MirrorBit Flash Family
S29GL032M10TAIR00 MirrorBit Flash Family
S29GL032M10TAIR03 MirrorBit Flash Family
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