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参数资料
型号： S29GL032M10BAIR53
厂商： SPANSION LLC
元件分类： PROM
英文描述： MirrorBit Flash Family
中文描述： 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封装： 8 X 6 MM, BGA-48
文件页数： 26/110页
文件大小： 4891K
代理商： S29GL032M10BAIR53
20
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B5 December 13, 2005
Data
Sheet
Notes:
1. Type 0 is standard. Specify others as required: TSOPs can be packed in Types 0 and 3; BGAs can
be packed in Types 0, 2, or 3.
2. This package is recommended for new designs using TSOPs.
3. TSOP package marking omits packing type designator from the ordering part number.
4. BGA package marking omits leading “S29” and packing type designator from the ordering part
number.
5. 100% Matte Sn is used for Pb-free TSOP plating.
6. SnBi is used for Pb-free TSOP plating.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult
your local sales office to confirm availability of specific valid combinations and to check on newly
released combinations.
Table 1. S29GL032M Ordering Options
S29GL032M Valid Combinations
Package Description
(Notes)
Device
Number
Speed
Option
Package, Material,
& Temperature Range
Model
Number
Packing
Type
S29GL032M
90
TAC,TFC
R0
0,2,3
(Note 1)
TS040 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
TAC,TFC
R1,R2
TS056 (2, 3, 5)
TSOP
FAC,FFC
LAA064 (4)
Fortified BGA
TAC,TFC
R3,R4
TS048 (2, 3, 5)
TSOP
BAC,BFC
FBC048 (4)
Fine-Pitch BGA
FAC,FFC
LAA064 (4)
Fortified BGA
90, 10, 11
TAI,TFI
R0
TS040 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
TAI,TFI
R1,R2
TS056 (2, 3, 5)
TSOP
FAI,FFI
LAA064 (4)
Fortified BGA
TAI,TFI
R3,R4
TS048 (2, 3, 5)
TSOP
BAI,BFI
FBC048 (4)
Fine-Pitch BGA
FAI,FFI
LAA064 (4)
Fortified BGA
TBI,TCI
FPT-48P-M19 (3, 6)
TSOP
BAI,BFI
R5,R6
FBG048 (4)
Fine-Pitch BGA
相关PDF资料
PDF描述
S29GL032M10BAIR60 MirrorBit Flash Family
S29GL032M10BAIR62 MirrorBit Flash Family
S29GL032M10BFIR52 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 8.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR53 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 9.0mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
S29GL032M10BFIR60 T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
相关代理商/技术参数
参数描述
S29GL032M10BAIR60 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BAIR62 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BBCR00 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BBCR02 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family
S29GL032M10BBCR03 制造商:SPANSION 制造商全称:SPANSION 功能描述:MirrorBit Flash Family
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