参数资料
型号: S29GL032M10BFIR60
厂商: SPANSION LLC
元件分类: PROM
英文描述: T528 Series - I, M, Z Case Sizes - Face Down Termination Tantalum Surface Mount Capacitor; Capacitance [nom]: 470uF; Working Voltage (Vdc)[max]: 2.5V; Capacitance Tolerance: +/-20%; Dielectric: Tantalum, Solid; ESR: 12mΩ; Lead Style: Surface-Mount Chip; Lead Dimensions: 7343-17; Termination: 100% Tin (Sn); Body Dimensions: 7.3mm x 4.3mm x 1.7mm; Temperature Range: -55C to +105C; Container: Tape & Reel; Qty per Container: 1,000; Features: Face Down Termination
中文描述: 2M X 16 FLASH 3V PROM, 100 ns, PBGA48
封装: 8 X 6 MM, LEAD FREE, BGA-48
文件页数: 14/110页
文件大小: 4891K
代理商: S29GL032M10BFIR60
108
S29GL-M MirrorBitTM Flash Family
S29GL-M_00_B5 December 13, 2005
Data
Sheet
Revision B4 (January 10, 2005)
Secured Sector Flash Memory Region
Updated Secured Silicon Sector address table with addresses in x8-mode
DC Characteristics, CMOS Compatible
Corrected WP#/ACC input load current footnote
Document
Updated cross-references and format.
Valid Combination Tables
Added notes to the 128 Mb and 256 Mb combination tables.
Revision B5 (December 13, 2005)
Added Supersession text.
Corrected typos on connection diagrams and in CFI table.
Colophon
The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary
industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for any use that
includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal
injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control,
medical life support system, missile launch control in weapon system), or (2) for any use where chance of failure is intolerable (i.e., submersible repeater and
artificial satellite). Please note that Spansion will not be liable to you and/or any third party for any claims or damages arising in connection with above-men-
tioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures
by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other
abnormal operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under
the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country, the prior au-
thorization by the respective government entity be required for export of those products.
Trademarks and Notice
The contents of this document are subject to change without notice. This document may contain information on a Spansion product under development by
Spansion LLC. Spansion LLC reserves the right to change or discontinue work on any product without notice. The information in this document is provided
as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose, merchantability, non-infringement
of third-party rights, or any other warranty, express, implied, or statutory. Spansion LLC assumes no liability for any damages of any kind arising out of the
use of the information in this document.
Copyright 2004–2005 Spansion LLC. All rights reserved.
Spansion, the Spansion logo, MirrorBit, combinations thereof, and ExpressFlash are trademarks of Spansion LLC. Other company and product names used in
this publication are for identification purposes only and may be trademarks of their respective companies.
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