www.hamamatsu.com
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 2010 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Smidesvgen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
Cat. No. KMPD1039E04 Nov. 2010 DN
Si PIN photodiodes
S3096-02, S4204
3
KMPDA0119EB
KMPDA0120EB
Dimensional outlines (unit: mm, tolerance unless otherwise noted: ±0.1)
S3096-02
S4204
Chip position accuracy with respect
to the package dimensions marked *
X, Y ≤ ±0.2
θ≤ ±2°
Lead surface finish: Silver plating
Packing: Stick (50 pcs/stick)
Anode A
Cathode common
Anode B
Cathode common
Active area
4.1 ± 0.2
(Including burr)
0.5
2.54
5.2 ± 0.2
4.0 *
0.8
0.25
4.5
±
0.3
Photosensitive
surface
5°
10°
5.0
±
0.2
(Including
burr)
4.8
*
4.7
*
Details of
active area
3.0
1.2
0.03
7.5° ± 5°
1.8
0.6
0.5
A
B
10°
5°
Active area
4.1 ± 0.2
(Including burr)
0.02
2.0
2.54
(0.8)
(1.25)
4.9 ± 0.4
4.0 *
(1.25)
(0.8)
13.8 ± 0.3
4.9 ± 0.4
5°
0.25
10°
0.5
0.8
1.8
5.0
±
0.2
(Including
burr)
4.7
*
4.8
*
5°
10°
Details of
active area
1.0
0.6
0.5
Photosensitive
surface
A
B
Chip position accuracy with respect
tothe package dimensions marked *
X, Y ≤ ±0.2
θ≤ ±2°
Lead surface finish: Silver plating
Packing: Stick (50 pcs/stick)
Anode A
Cathode common
Anode B
Cathode common