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参数资料
| 型号： | S4011-04 |
| 元件分类： | 光敏二极管 |
| 英文描述： | PHOTO DIODE |
| 封装： | PLASTIC PACKAGE-4 |
| 文件页数： | 4/4页 |
| 文件大小： | 773K |
| 代理商： | S4011-04 |
www.hamamatsu.com
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 2008 Hamamatsu Photonics K.K.
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Smidesvgen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
Cat. No. KSPD1025E03 Sep. 2008 DN
Si photodiodes
S5493-01, etc.
4
5.0
±
0.2
(Including
burr)
4.7
*
10°
4.8
*
5°
0.5
0.6
2.54
1.5 ± 0.4
1.8
0.8
10°
5°
7.0 ± 0.3
0.7 ± 0.3
0.25
0.1
±
0.1
Photosensitive
surface
4.0
*
4.1 ± 0.2
(Including burr)
Anode
Cathode
NC
Cathode
Chip position accuracy with
respect to the package
dimensions marked
*
X, Y ±0.2
θ ±2°
Lead surface finish: Silver plating
Packing: Stick (50 pcs/stick)
NC
Cathode
Anode
Cathode
4.6 ± 0.2
(Including burr)
4.5
*
5.0 ± 0.4
(1.0)
14.5 ± 0.3
(0.8)
0.7
0.5
5.6
±
0.2
(Including
burr)
0.3
Max.
0.3
Max.
5°
1.0
0.25
2.0
3°
5.4
*
10°
5.5
*
3°
2.54
(0.8)
0.7
Photosensitive
surface
Chip position accuracy with
respect to the package
dimensions marked
*
X, Y ±0.2
θ ±2°
Lead surface finish: Silver plating
Packing: Stick (50 pcs/stick)
S2833-01
S4011-04
KSPDA0123EB
KSPDA0163EB
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