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参数资料
| 型号： | S596-11-225-08-001445 |
| 厂商： | MILL-MAX MFG CORP |
| 元件分类： | 插座 |
| 英文描述： | BGA225, IC SOCKET |
| 文件页数： | 2/2页 |
| 文件大小： | 106K |
| 代理商： | S596-11-225-08-001445 |
SPECIFICATIONS:
Materials:
- Socket contact: Three finger, stamped beryllium
copper alloy 172, HT (Mill-Max type #04); plated 10”
gold over 50” nickel
- Socket shell and adapter pins: Precision machined
brass alloy; plated 10” gold over 100” nickel
- Insulator material: .047” thick glass-epoxy type FR-4,
rated UL94V-0.
TCE = 10-13ppm/°C,
εr = 5.0
Mechanical:
- Insertion and withdrawal forces (using .010” dia.
polished steel gage pin): Insertion: .36N typ. per pin
Withdrawal: .20N typ. per pin
- Insertion force of an actual 225 pin device: 90N
- Durability: 100 cycles
- Coplanarity: <.005”
Electrical:
- Current rating (per pin): 1 A
- Working voltage: 100 VRMS/150 VDC max.
- Low level contact resistance: 10 m
max.
- Insulation resistance @ 500 VRMS:
Initial value: 1,000,000 M
min.
After climatic tests: 10,000 M
min.
- Dielectric withstanding voltage: 500 VRMS
- Capacitance between adjacent contacts: 1 pF max.
- Self inductance per pin: 2 nH max.
- Electrical length: 31 pS
Environmental:
- Operating temperature range: -55 °C to +125 °C
BGA adapter/socket systems have withstood the following envi-
ronmental tests without mechanical or electrical failure:
- Damp heat, steady state: 40 °C, 93% rH, 21 days
- Damp heat, cyclic: 25/55 °C, 6 days
- Dry heat: 100°C, 1,000 hours
- Thermal shock: -55 to +125 °C, 5 cycles
- Random vibration: 50 to 500 Hz, 8g, 20 min. per axis
- Shock: 50 g per axis
- Solderability: 235 °C, 2 seconds
- Resistance to soldering heat: 270 °C, 10 seconds
- Resistance to corrosion:
Salt spray: 48 hours
Sulphur dioxide: 96 hours @ 25 ppm SO2, 25 °C, 75% rH
Hydrogen sulphide: 96 hours @ 12 ppm H2S, 25°C, 75% rH
This footprint represents a popular 225 position BGA device. Adapters and sockets are sold
separately, order as:
PCB ADAPTER #: S579-10-225-08-001429 (not solder dipped)
or PCB ADAPTER #: S596-10-225-08-001461 (solder dipped)
BGA ADAPTER #: S599-10-225-08-001429 (not solder dipped)
SOCKET #: S596-11-225-08-001445 (solder dipped only)
Contact the Mill-Max Technical Services Department for other standard footprints.
MILL-MAX 0.8mm GRID BGA SOCKET / ADAPTER SYSTEMS
.035
TYP.
.512 SQUARE
0,8mm
TYP.
SOLDER DIPPED
(62Sn2Ag36Pb)
SOLDER DIPPED
(OPTIONAL)
PCB
ADAPTER
BGA
ADAPTER
SOCKET
.018
.054
.141
.123
.090
.140
MATED
HEIGHT
.010 DIA.
.024 DIA.
.027 DIA.
.047
.054
.025
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