Features
l Large active area
S5980: 5 × 5 mm
S5981: 10 × 10 mm
S5870: 10 × 10 mm
l Chip carrier package suitable for surface mounting
Facilitates automated surface mounting by solder reflow
l Thin package: 1.26 mmt
l Photo sensitivity: 0.72 A/W (λ=960 nm)
Applications
l Laser beam axis alignment
l Level meters
l Pointing devices, etc.
PHOTODIODE
Si PIN photodiode
Multi-element photodiodes for surface mounting
S5980, S5981, S5870
s General ratings
Parameter
Symbol
S5980
S5981
S5870
Unit
Window material
-
Resin coating
-
G ap betw een elem ents
-
30
m
Active area
A
5.0/4 elements
10.0/4 elements
10.0/2 elements
mm
s Absolute maximum ratings
Parameter
Symbol
S5980
S5981
S5870
Unit
Reverse voltage
VR Max.
30
V
O perating tem perature
Topr
-40 to +100
°C
Storage temperature
Tstg
-40 to +125
°C
s Electrical and optical characteristics (Ta=25
°C, per 1 element)
S5980
S5981
S5870
Parameter
Symbol
Condition
Typ.
Max.
Typ.
Max.
Typ.
Max.
Unit
Spectral response range
λ
320 to 1100
-
320 to 1100
-
320 to 1100
-
nm
Peak sensitivity
wavelength
λp
960
-
960
-
960
-
nm
Photo sensitivity
S
λ=λp
0.72
-
0.72
-
0.72
-
A/W
Dark current
ID
VR=10 V
0.3
2
0.6
4
2
10
nA
Te m p era tu re coefficient of ID
TCID
1.15
-
1.15
-
1.15
-
times/°C
Cut-off frequency
fc
VR=10 V, RL=50
, -3 dB
25
-
20
-
10
-
MHz
Te rm inal c a pa cita nc e
Ct
VR=10 V, f=1 MHz
10
-
35
-
50
-
pF
N oise equivalent power
NEP
VR=10 V,
λ=λp
1.4 × 10 -14
-
1.9 × 10 -14
-
3.5 × 10 -14
-
W/Hz1/2
Note) S5980: For mass production, order unit is 100 pieces.
S5981, S5870: For mass production, order unit is 50 pieces.
q The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that
can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window
to prevent such troubles.
q Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5
seconds maximum time under the conditions that no moisture absorption occurs.
Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use.
q Silicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol.
q Avoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin
from absorbing moisture.
When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in
nitrogen atmosphere at 150 °C for 3 to 5 hours or at 120 °C for 12 to 15 hours before use.
Precautions for use
1