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参数资料
| 型号： | S5991-01 |
| 元件分类： | 光敏二极管 |
| 英文描述： | PHOTO DIODE |
| 封装： | SURFACE MOUNT PACKAGE-10 |
| 文件页数： | 2/2页 |
| 文件大小： | 384K |
| 代理商： | S5991-01 |
Two-dimensional PSD
S5990-01, S5991-01
HAMAMATSU PHOTONICS K.K., Solid State Division
1126-1 Ichino-cho, Higashi-ku, Hamamatsu City, 435-8558 Japan, Telephone: (81) 53-434-3311, Fax: (81) 53-434-5184, www.hamamatsu.com
U.S.A.: Hamamatsu Corporation: 360 Foothill Road, P.O.Box 6910, Bridgewater, N.J. 08807-0910, U.S.A., Telephone: (1) 908-231-0960, Fax: (1) 908-231-1218
Germany: Hamamatsu Photonics Deutschland GmbH: Arzbergerstr. 10, D-82211 Herrsching am Ammersee, Germany, Telephone: (49) 08152-3750, Fax: (49) 08152-2658
France: Hamamatsu Photonics France S.A.R.L.: 19, Rue du Saule Trapu, Parc du Moulin de Massy, 91882 Massy Cedex, France, Telephone: 33-(1) 69 53 71 00, Fax: 33-(1) 69 53 71 10
United Kingdom: Hamamatsu Photonics UK Limited: 2 Howard Court, 10 Tewin Road, Welwyn Garden City, Hertfordshire AL7 1BW, United Kingdom, Telephone: (44) 1707-294888, Fax: (44) 1707-325777
North Europe: Hamamatsu Photonics Norden AB: Smidesvgen 12, SE-171 41 Solna, Sweden, Telephone: (46) 8-509-031-00, Fax: (46) 8-509-031-01
Italy: Hamamatsu Photonics Italia S.R.L.: Strada della Moia, 1/E, 20020 Arese, (Milano), Italy, Telephone: (39) 02-935-81-733, Fax: (39) 02-935-81-741
Information furnished by HAMAMATSU is believed to be reliable. However, no responsibility is assumed for possible inaccuracies or omissions.
Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 2007 Hamamatsu Photonics K.K.
Cat. No. KPSD1010E04
Dec. 2007 DN
Burrs shall protrude no more than
0.3 mm on any side of package.
pin should be open-circuited
ANODE X1 (I1)
NC
ANODE Y1 (I3)
ANODE X2 (I2)
NC
CATHODE
NC
ANODE Y2 (I4)
ANODE X1 (I1)
NC
ANODE Y1 (I3)
ANODE X2 (I2)
NC
CATHODE
NC
ANODE Y2 (I4)
Burrs shall protrude no more than
0.3 mm on any side of package.
pin should be open-circuited
(4 ×) R0.3
16.5
±
0.2
1.8
2.54
3.0
0.46
1.26
±
0.15
(10
×) 1.2
14.5 ± 0.2
1.8
ACTIVE AREA
PHOTOSENSITIVE
SURFACE
SILICONE
RESIN
o9.0
Y2
X2
X1
Y1
s Spectral response
s Dimensional outlines (unit: mm)
KPSDB0026EA
KPSDA0044EB
300
400
500
600
700
800
WAVELENGTH (nm)
PHOTO
SENSITIVITY
(A/W)
0
900 1000 1100
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
(Typ. Ta=25 C)
s Dark current vs. reverse voltage
KPSDB0068EA
s Terminal capacitance vs. reverse voltage
KPSDB0073EA
10 nA
1 nA
100 pA
DARK
CURRENT
REVERSE VOLTAGE (V)
10 pA
1 pA
0.1
1
10
100
S5990-01
S5991-01
(Typ. Ta=25 C)
0.1
1
10
100
10 pF
100 pF
1 nF
10 nF
REVERSE VOLTAGE (V)
TERMINAL
CAPACITANCE
(Typ. Ta=25 C)
S5991-01
S5990-01
s Example of position detectability
(Ta=25 °C,
λ=830 nm,
Spot light size:
φ0.2 mm)
(SCAN INTERVAL: 0.4 mm)
(SCAN INTERVAL: 1 mm)
8.8 ± 0.15
(4
×) R0.3
10.6
±
0.2
1.5
1.27
1.5
2.5
0.46
1.26
±
0.15
(10
×) 0.6
SILICONE
RESIN
PHOTOSENSITIVE
SURFACE
ACTIVE AREA
o4.0
Y2
X2
Y1
X1
INDEX MARK
KPSDA0045EA
S5990-01
S5991-01
S5990-01
S5991-01
s Conversion formula
KPSDC0064EA
KPSDC0065EA
x, y: position coordinate of spot light
S5990-01: L=4.5 mm
S5991-01: L=10 mm
(I2 + I3) - (I1 + I4)
2x
I1 + I2 + I3 + I4
L
=
(I2 + I4) - (I1 + I3)
2y
I1 + I2 + I3 + I4
L
=
q The light input window of this product uses soft silicone resin. Avoid touching the window to keep it from grime and damage that
can decrease sensitivity. External force applied to the resin surface may deform or cut off the wires, so do not touch the window
to prevent such troubles.
q Use rosin flux when soldering, to prevent the terminal lead corrosion. Reflow oven temperature should be at 260 °C maximum for 5
seconds maximum time under the conditions that no moisture absorption occurs.
Reflow soldering conditions differ depending on the type of PC board and reflow oven. Carefully check these conditions before use.
q Silicone resin swells when it absorbs organic solvent, so do not use any solvent other than alcohol.
q Avoid unpacking until you actually use this product to prevent the terminals from oxidation and dust deposits or the coated resin
from absorbing moisture.
When the product is stored for 3 months while not unpacked or 24 hours have elapsed after unpacking, perform baking in
nitrogen atmosphere at 150 °C for 3 to 5 hours or at 120 °C for 12 to 15 hours before use.
Precautions for use
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