参数资料
型号: S71GL064A08BAI0F3
厂商: SPANSION LLC
元件分类: 存储器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory and RAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA56
封装: 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
文件页数: 25/134页
文件大小: 2383K
代理商: S71GL064A08BAI0F3
118
S71GL064A based MCPs
S71GL064A_00_A2 February 8, 2005
Advance
Info rmation
Note: The tC2LH specifies after VDD reaches specified minimum level.
Figure 53. Power-up Timing #1
Note: The tCHH specifies after VDD reaches specified minimum level and applicable to both CE1# and CE2.
Figure 54. Power-up Timing #2
Note: This Power Down mode can be also used as a reset timing if POWER-UP timing above could not be satisfied and
Power-Down program was not performed prior to this reset.
Figure 55. Power Down Entry and Exit Timing
tC2LH
CE1#
VDD
VDD min
0V
CE2
tCHH
tCHS
CE1#
VDD
VDD min
0V
CE2
tCHH
tCSP
CE1#
Power Down Entry
CE2
tC2LP
tCHH (tCHHP)
Power Down Mode
Power Down Exit
tCHS
DQ
High-Z
相关PDF资料
PDF描述
S71GL064A08BAW0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B2 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0B3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BFI0F3 Stacked Multi-Chip Product (MCP) Flash Memory and RAM
相关代理商/技术参数
参数描述
S71GL064A08BAW0B0 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0B2 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0B3 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F0 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM
S71GL064A08BAW0F2 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and RAM