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参数资料
| 型号： | S71PL064J80BAWTZ2 |
| 厂商： | Spansion Inc. |
| 英文描述： | Based MCPs |
| 中文描述： | 基于MCP的 |
| 文件页数： | 17/24页 |
| 文件大小： | 296K |
| 代理商： | S71PL064J80BAWTZ2 |
March 17, 2006S71PL-J_00_B3
S71PL-J Based MCPs
15
A d v a n c e I n f o r m a t i o n
TSC056—56-ball Fine-Pitch Ball Grid Array (FBGA) 9 x 7mm Package
3427 \ 16-038.22
PACKAGE
TSC 056
JEDEC
N/A
D x E
9.00 mm x 7.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
0.17
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
9.00 BSC.
BODY SIZE
E
7.00 BSC.
BODY SIZE
D1
5.60 BSC.
MATRIX FOOTPRINT
E1
5.60 BSC.
MATRIX FOOTPRINT
MD
8
MATRIX SIZE D DIRECTION
ME
8
MATRIX SIZE E DIRECTION
n
φ
b
eE
56
BALL COUNT
0.35
0.40
0.45
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A1,A8,D4,D5,E4,E5,H1,H8
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
E1
7
SE
A
D1
eD
D
C
E
F
G
H
8
7
6
4
3
2
1
eE
5
B
PIN A1
CORNER
7
SD
BOTTOM VIEW
C
0.08
0.20
C
A
E
B
C
0.15
(2X)
C
D
C
0.15
(2X)
INDEX MARK
10
6
b
TOP VIEW
SIDE VIEW
CORNER
56X
A1
A2
A
0.15
0.08
M
M
C
C
A B
PIN A1
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相关代理商/技术参数 |
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|---|---|
| S71PL064J80BAWTZ3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Based MCPs |
| S71PL064J80BFW070 | 制造商:Spansion 功能描述:COMBO MEM 2M X 16 FLASH + 256K X 16 SRAM 3.3V 56-PIN FBGA - Trays |
| S71PL064J80BFW0Z0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Based MCPs |
| S71PL064J80BFW0Z2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Based MCPs |
| S71PL064J80BFW0Z3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Based MCPs |
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