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参数资料
| 型号： | S71PL127ND0HFW5B3 |
| 厂商： | Spansion Inc. |
| 英文描述： | MirrorBit MCPs |
| 中文描述： | 的MirrorBit MCP的 |
| 文件页数： | 8/14页 |
| 文件大小： | 182K |
| 代理商： | S71PL127ND0HFW5B3 |
6
S71PL-N MirrorBit
TM
MCPs
S71PL-N_00_A9 December 8, 2006
D a t a
S h e e t
Figure 5.2
TSB084 Physical Dimensions
3439 \ 16-038.22 \ 01.04.05
PACKAGE
TSB 084
JEDEC
N/A
D x E
11.60 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
0.17
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
φ
b
eE
84
BALL COUNT
0.35
0.40
0.45
BALL DIAMETER
0.80 BSC
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC
SOLDER BALL PLACEMENT
B1,B10,C1,C10,D1,D10
M2,M3,M4,M5,M6,M7,M8,M9
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
C
C
0.08
A1
b
84X
0.15
0.08
M
M
C
C
A B
6
SIDE VIEW
7
SE
E1
CORNER
PIN A1
A
C
D
B
D1
A
10
eD
9
8
6
5
3
eE
2
4
7
E
D
0.15
C
(2X)
G
F
E
K
J
H
SD
7
M
L
1
C
C
0.15
B
(2X)
0.20
10
CPIN A1
INDEX MARK
A2
A
TOP VIEW
BOTTOM VIEW
相关PDF资料 |
PDF描述 |
|---|---|
| S71PL129JB0 | Stacked Multi-Chip Product (MCP) Flash Memory |
| S71PL129JC0BAI9U3 | Stacked Multi-Chip Product (MCP) Flash Memory |
| S71PL129JB0BAI9U3 | Stacked Multi-Chip Product (MCP) Flash Memory |
| S71PL129JA0BAI9U3 | Circular Connector; No. of Contacts:5; Series:MS27473; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:14-5 RoHS Compliant: No |
| S71PL129JC0BAI9Z0 | Circular Connector; No. of Contacts:5; Series:MS27473; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:14-5 RoHS Compliant: No |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71PL129JA0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory and pSRAM 128 Megabit (8M x 16-bit) CMOS3.0 Volt-only Simultaneous Operation, Page Mode Flash Memory |
| S71PL129JA0BAI9B0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory |
| S71PL129JA0BAI9B2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory |
| S71PL129JA0BAI9B3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory |
| S71PL129JA0BAI9P0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) Flash Memory |
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