参数资料
型号: S71PL129JB0BAW9B2
厂商: SPANSION LLC
元件分类: 存储器
英文描述: Stacked Multi-Chip Product (MCP) Flash Memory
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA64
封装: 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-64
文件页数: 11/149页
文件大小: 2693K
代理商: S71PL129JB0BAW9B2
December 23, 2004 S71PL129Jxx_00_A5
11
A d v a n c e I n f o r m a t i o n
Physical Dimensions
TLA064—64-ball Fine-Pitch Ball Grid Array (FBGA)
8 x 11.6 mm Package
3352 \ 16-038.22a
PACKAGE
TLA 064
JEDEC
N/A
D x E
11.60 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
---
1.20
PROFILE
A1
0.17
---
---
BALL HEIGHT
A2
0.81
---
0.97
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
φ
b
eE
64
BALL COUNT
0.35
0.40
0.45
BALL DIAMETER
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A2,A3,A4,A5,A6,A7,A8,A9
F1,F5,F6,F10,G1,G5,G6,G10
H1,H10,J1,J10,K1,K2,K9,K10
ML1,L2,L3,L4,L7,L8,L9,L10
DEPOPULATED SOLDER BALLS
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
C
0.20
C
0.08
C
b
64X
6
0.08 M C
0.15 M C A B
A2
A
A1
SIDE VIEW
L
M
eD
CORNER
E1
7
SE
D1
A
B
D
C
E
F
H
G
10
8
9
7
5
6
4
2
3
J
K
1
eE
SD
BOTTOM VIEW
PIN A1
7
10
INDEX MARK
C
0.15
(2X)
(2X)
C
0.15
B
A
D
E
PIN A1
CORNER
TOP VIEW
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