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参数资料
| 型号： | S71WS256NC0BAWAK2 |
| 厂商： | SPANSION LLC |
| 元件分类： | 存储器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封装： | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84 |
| 文件页数： | 1/13页 |
| 文件大小： | 332K |
| 代理商： | S71WS256NC0BAWAK2 |
Publication Number S71WS-N_00
Revision A
Amendment 6
Issue Date July 19, 2006
S71WS-N
S71WS-N Cover Sheet
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet (Advance Information)
Notice to Readers: This document states the current technical specifications regarding the Spansion
product(s) described herein. Each product described herein may be designated as Advance Information,
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.
相关PDF资料 |
PDF描述 |
|---|---|
| S71WS256NC0BAWAK3 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN0 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN2 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN3 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | Stacked Multi-Chip Product (MCP) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71WS256NC0BAWAK3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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