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参数资料
| 型号： | S71WS256NC0BAWAN0 |
| 厂商： | SPANSION LLC |
| 元件分类： | 存储器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封装： | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84 |
| 文件页数： | 7/13页 |
| 文件大小： | 332K |
| 代理商： | S71WS256NC0BAWAN0 |
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.
Publication Number S71WS-N_00
Revision A
Amendment 6
Issue Date July 19, 2006
Features
Power supply voltage of 1.7 V to 1.95 V
Burst Speed: 54 MHz, 66 MHz, 80 MHz
Package
– 8 x 11.6 mm, 9 x 12 mm
Operating Temperature
– Wireless, –25° C to +85° C
General Description
The S71WS-N Series is a product line of stacked Multi-Chip Product (MCP) packages and consists of the following items:
One or more flash memory die (for the S71WS512N, two S29WS256N devices are used)
CellularRAM Type 2 pSRAM
The products covered by this document are listed in the table below. For details about their specifications, please refer to the
individual constituent datasheet for further details.
For detailed specifications, please refer to the individual data sheets.
S71WS-N
Stacked Multi-Chip Product (MCP)
1.8 Volt-only Simultaneous Read/Write,
Burst-mode Flash Memory with CellularRAM
Data Sheet (Advance Information)
Flash Density
pSRAM
32 Mb
64 Mb
128 Mb
S29WS128N
S71WS128NB0
S71WS128NC0
S29WS256N
S71WS256NC0
S71WS256ND0
S29WS512N
S71WS512NC0
S71WS512ND0
Document
Publication Identification Number (PID)
S29WS-N
S29WS-N_00
128 M CellularRAM Type 2
Cellram_04
32 M CellularRAM Type 2
Cellram_06
64 M CellularRAM Type 2
Cellram_07
相关PDF资料 |
PDF描述 |
|---|---|
| S71WS256NC0BAWAN2 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN3 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP2 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP3 | Stacked Multi-Chip Product (MCP) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71WS256NC0BAWAN2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAN3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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