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参数资料
| 型号： | S71WS256NC0BAWAN2 |
| 厂商： | SPANSION LLC |
| 元件分类： | 存储器 |
| 英文描述： | Stacked Multi-Chip Product (MCP) |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA84 |
| 封装： | 8 X 11.60 MM, 1.20 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-84 |
| 文件页数： | 8/13页 |
| 文件大小： | 332K |
| 代理商： | S71WS256NC0BAWAN2 |
2
S71WS-N
S71WS-N_00_A6 July 19, 2006
Data
Sheet
(Adv an ce
Inf o r m a t io n)
1.
Product Selector Guide
Note:
0 (Protected), 1 (Unprotected [Default State])
Device
Model
Numbers
Flash
pSRAM
Density
(Mb)
Flash
Speed
(MHz)
pSRAM
Speed
(MHz)
DYB
Power-Up
State
pSRAM
(Cellular RAM)
Supplier
Package
(mm)
S71WS128NB0
AK
WS128N
32
54
0
2
8.0X11.6X1.2
AP
1
AJ
66
0
AN
1
AH
80
0
AM
1
S71WS128NC0
AK
WS128N
64
54
0
2
8.0X11.6X1.2
AP
1
AJ
66
0
AN
1
AH
80
0
AM
1
S71WS256NC0
AK
WS256N
64
54
0
2
11.6x8.0x1.2
AP
1
AJ
66
0
2
AN
1
AH
80
0
2
AM
1
S71WS256ND0
YK
128
54
0
2
9x12x1.2
YP
1
YJ
66
0
YN
1
YH
80
0
YM
1
S71WS512NC0
AK
WS512N
64
54
0
2
11.6x8.0x1.2
AP
1
TJ
66
0
2
11.6x8.0x1.4
TN
1
TH
80
0
2
TM
1
S71WS512ND0
EK
128
54
0
2
9x12x1.4
EP
1
EJ
66
0
EN
1
EH
80
0
EM
1
相关PDF资料 |
PDF描述 |
|---|---|
| S71WS256NC0BAWAN3 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP2 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP3 | Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BFWAN3 | Stacked Multi-Chip Product (MCP) |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S71WS256NC0BAWAN3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP2 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWAP3 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
| S71WS256NC0BAWE20 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
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